Article
  • A Study on Thermal Conductivity and Fracture Toughness of Alumina Nanofibers and Powders-filled Epoxy Matrix Composites
  • Choi JR, Park SJ
  • 알루미나 나노섬유와 분말이 첨가된 에폭시 복합재료의 열전도도 특성 및 파괴인성에 대한 연구
  • 최정란, 박수진
References
  • 1. Schwartz MM, Nanocomposites Materials Handbook, 2nd ed., McGraw-Hill, New York (1992)
  •  
  • 2. Terasaki I, Comprehensive Semiconductor Science and Technology, Chapter 1.09, 326 (2011)
  •  
  • 3. Ma PC, Siddiqui NA, Marom G, Kim JK, Compos. A;Appl. Sci. Manuf., 41, 1345 (2010)
  •  
  • 4. Martone A, Formicola C, Giordano M, Zarrelli M, Compos.Sci. Technol., 70, 1154 (2010)
  •  
  • 5. Hou Y, Guo LP, Wang G, J. Electroanal. Chem., 617(2), 211 (2008)
  •  
  • 6. Lee GW, Park M, Kim J, Lee JI, Yoon HG, Compos.A; Appl. Sci. Manuf., 37, 727 (2006)
  •  
  • 7. Ishida H, Rimdusit S, Thermochim. Acta, 320(1-2), 177 (1998)
  •  
  • 8. Nagai Y, Lai GC, J. Ceram. Soc. Jpn., 105, 197 (1997)
  •  
  • 9. Choi YS, Lee HW, Lee JH, Park YI, Kim CE, J. Kor.Cerm. Soc., 32, 995 (1995)
  •  
  • 10. Parker WJ, Jenkins RJ, Butler CP, Abbot GL, J. Appl.Phys., 32, 1679 (1961)
  •  
  • 11. Abdalla M, Dean D, Theodore M, Fielding J, Nyairo E, Price G, Polymer, 51(7), 1614 (2010)
  •  
  • 12. Santos WN, Mummery P, Wallwork A, Polymer., 24, 628 (2005)
  •  
  • 13. Zhou WY, Qi SH, Tu CC, Zhao HZ, Wang CF, Kou JL, J. Appl. Polym. Sci., 104(2), 1312 (2007)
  •  
  • 14. Heo GY, Park SJ, Macromol. Res., 17(11), 870 (2009)
  •  
  • 15. Lee SB, Lee HJ, Hong IK, J. Ind. Eng. Chem., 18(2), 635 (2012)
  •  
  • 16. Park SJ, Park WB, Lee JR, Polym. J., 31, 28 (1999)
  •  
  • 17. Heo GY, Rhee KY, Park SJ, Polym.(Korea), 35(6), 548 (2011)
  •  
  • 18. Hong J, Park DW, Shim SE, Carbon Lett., 11, 347 (2010)
  •  
  • 19. Park SJ, Kim KS, Carbon Lett., 13, 51 (2012)
  •  
  • 20. Tao ZQ, Yang SY, Chen JS, Fan L, Eur. Polym. J., 43, 1470 (2007)
  •  
  • 21. Zhou W, Qi S, Li H, Shao S, Thermochim. Acta., 36, 452 (2007)
  •  
  • 22. Dashora P, Gupta G, Polymer, 37(2), 231 (1996)
  •  
  • 23. Kim W, Bae JW, Choi ID, Kim YS, Polym. Eng. Sci., 39(4), 756 (1999)
  •  
  • 24. Park SJ, Kim HC, J. Polym. Sci. B: Polym. Phys., 39(1), 121 (2001)
  •  
  • 25. Park SJ, Heo GY, Oh SY, Choi KE, Carbon Lett., 12, 53 (2011)
  •  
  • 26. Deng XL, Yang XP, Carbon Lett., 13, 139 (2012)
  •  
  • 27. Lee WS, Yu J, Diam. Relat. Mater., 14, 1647 (2005)
  •  
  • 28. Santos WN, Mummery P, Wallwork A, Polym. Test., 24, 628 (2005)
  •  
  • 29. Park SJ, Jun BR, J. Colloid Interface Sci., 284(1), 204 (2005)
  •  
  • 30. Kim W, Bae JW, Choi ID, Kim YS, Polym. Eng. Sci., 39(4), 756 (1999)
  •  
  • 31. Munz DG, Shannon J, Bubsey LJ, Raymond T, Int. J.Fract., 16, 137 (1980)
  •  
  • 32. Smith RP, Li D, Francis DW, Chappuis J, Neumann AW, J. Colloid Interface Sci., 157, 478 (1993)
  •  
  • 33. Lu MG, Shim MJ, Kim SW, Polym. Int., 48, 787 (1999)
  •  
  • 34. Ko JH, Kim JC, Chang JH, Polym.(Korea), 33(4), 333 (2009)
  •  
  • 35. Zheng SX, Wang JA, Guo QP, Wei J, Li JA, Polymer, 37(21), 4667 (1996)
  •  
  • 36. Kim HC, Jeon S, Kim HI, Choi HS, Hong MH, Choi KS, Polymer(Korea)., 35, 563 (2011)
  •  
  • Polymer(Korea) 폴리머
  • Frequency : Bimonthly(odd)
    ISSN 0379-153X(Print)
    ISSN 2234-8077(Online)
    Abbr. Polym. Korea
  • 2023 Impact Factor : 0.4
  • Indexed in SCIE

This Article

  • 2013; 37(1): 47-51

    Published online Jan 25, 2013

  • 10.7317/pk.
  • Received on Jul 30, 2012
  • Revised on Nov 30, -0001
  • Accepted on Sep 28, 2012

Correspondence to

  • E-mail: