Article
  • A Study on the Improvement of the Thermal Stability of PE Separator for Lithium Secondary Battery Application Using Poly(meta-phenylene isophthalamide)
  • Park M, Ra BH, Bae JY, Kim BH, Choi WK
  • Poly(meta-phenylene isophthalamide)를 이용한 리튬이차전지용 PE 분리막의 고내열화 연구
  • 박민아, 라병호, 배진영, 김병현, 최원근
References
  • 1. Ozawa K, Solid State Ion., 69(3-4), 212 (1994)
  •  
  • 2. Laman FC, Gee MA, Denovan J, J. Electrochem. Soc., 140, L51 (1993)
  •  
  • 3. Arora P, Zhang ZM, Chem. Rev., 104(10), 4419 (2004)
  •  
  • 4. Jundquist J, Landsager C, Palmer N, Troffkin H, US Patent 4650730 (1988)
  •  
  • 5. Jundquist J, Landsager C, Palmer N, Troffkin H, US Patent 4731304 (1988)
  •  
  • 6. Fisher HM, Wensley CG, US Patent 6368742 (2002)
  •  
  • 7. Cho TH, Tanaka M, Onishi H, Kondo Y, Nakamura T, Yamazaki H, Tanase S, Sakai T, J. Power Sources, 181(1), 155 (2008)
  •  
  • 8. Sohn JY, Lim JS, Gwon SJ, Shin JH, Choi JH, Nho YC, Polym.(Korea), 32(6), 598 (2008)
  •  
  • 9. Im JS, Sohn JY, Shin J, Lim YM, Choi JH, Kim JS, Nho YC, Polym.(Korea), 34(1), 74 (2010)
  •  
  • 10. Charya AB, Prog. Polym. Sci., 25, 371 (2000)
  •  
  • 11. Chung YS, Yoo SH, Kim CK, Ind. Eng. Chem. Res., 9, 4346 (2009)
  •  
  • 12. Jeong HS, Kim KC, Lee SY, J. Korean. Electrochem.Soc., 12, 324 (2009)
  •  
  • 13. Jeong HS, Noh JH, Hwang CG, Hwang CG, Kim SH, Lee SY, Macromol. Chem. Phys., 211, 420 (2010)
  •  
  • 14. Chung YS, Yoo SH, Kim CK, Ind. Eng. Chem. Res., 48(9), 4346 (2009)
  •  
  • 15. Kim M, Shon JY, Nho YC, Lee TW, Park JH, J. Electrochem. Soc., 157(1), A31 (2010)
  •  
  • 16. Nishikawa S, US Patent 0165450 (2011)
  •  
  • 17. Nishikawa S, US Patent 0143185A1 (2011)
  •  
  • Polymer(Korea) 폴리머
  • Frequency : Bimonthly(odd)
    ISSN 0379-153X(Print)
    ISSN 2234-8077(Online)
    Abbr. Polym. Korea
  • 2023 Impact Factor : 0.4
  • Indexed in SCIE

This Article

  • 2013; 37(1): 22-27

    Published online Jan 25, 2013

  • 10.7317/pk.
  • Received on Jun 8, 2012
  • Revised on Nov 30, -0001
  • Accepted on Sep 13, 2012

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