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Submitted (~23-08-31)
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Submitted (23-09-01~)
Article
Enhancement of Wetting Characteristics for Anisotropic Conductive Adhesive with Low Melting Point Solder via Carboxylic Acid-based Novel Reductants
Kim HM, Kim JH
카르복실산계 환원제를 통한 저융점 솔더입자가 포함된 이방성 전도성 접착제의 젖음 특성 향상 연구
김효미, 김주헌
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Polymer(Korea)
폴리머
Frequency : Bimonthly(odd)
ISSN 0379-153X(Print)
ISSN 2234-8077(Online)
Abbr. Polym. Korea
2023 Impact Factor : 0.4
Indexed in SCIE
This Article
2010; 34(1): 52-57
Published online Jan 25, 2010
10.7317/pk.
Received on Sep 7, 2009
Revised on Nov 30, -0001
Accepted on Oct 16, 2009
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