Article
  • Characterizations of Adhesion Property, Morphology and Cure Reaction of Epoxy/Polyamide/MPD Reactive Blend with Imidazole(2E4MZ-CN) Catalyst
  • Song HW, Kang HS, Kim WH, Marzi S, Kim BM, Choe YS
  • 이미다졸(2E4MZ-CN) 촉매 첨가에 의한 에폭시/폴리아미드/MPD 반응성 블렌드의 경화 반응, 형태학적 특징 및 접착력 향상 연구
  • 송현우, 강학수, 김원호, 스테판 말지, 김병민, 최영선
References
  • 1. Kim DG, Park SY, Park CR, Polym.(Korea), 24(1), 58 (2000)
  •  
  • 2. Pascault JP, Sautereau H, Verdu J, Williams RJJThermosetting Polymers, Plastics Engineering Series/64, Marcel-Dekker Inc., New York, p 226 (2002)
  •  
  • 3. Su CC, Woo EM, Huang YP, Polym. Eng. Sci., 45(1), 1 (2005)
  •  
  • 4. Lahlali D, Naffakh M, Dumon M, Polym. Eng. Sci., 45(12), 1581 (2005)
  •  
  • 5. Prologo SG, Buron M, Rodriquez J, J. Therm. Anal. Cal., 87, 269 (2007)
  •  
  • 6. Prologo SG, Prologon MG, J. Therm. Anal. Cal., 87, 259 (2007)
  •  
  • 7. Prolongo SG, Cabanelas JC, Fine T, Pascault JP, J. Appl. Polym. Sci., 93(6), 2678 (2004)
  •  
  • 8. Arribas C, Masegosa RM, Salom C, Arevalo E, Prolongo SG, Prolongo MG, J. Therm. Anal. Cal., 86, 693 (2006)
  •  
  • 9. Bucknall CB, Gomez CM, Quintard I, Polymer, 35(2), 353 (1994)
  •  
  • 10. Kim BS, Chiba T, Inoue T, Polymer, 36(1), 43 (1995)
  •  
  • 11. Bucknall CB, Partridge IK, Polymer, 24, 639 (1983)
  •  
  • 12. Venderbosch RW, Meijer HE, Lemstra PJ, Polymer, 35(20), 4349 (1994)
  •  
  • 13. Bonnet A, Pascault JP, Sautereau H, Taha M, Camberlin Y, Macromolecules, 32(25), 8517 (1999)
  •  
  • 14. Venderbosch RW, Meijer HE, Lemstra PJ, Polymer, 36(6), 1167 (1995)
  •  
  • 15. Kim BC, Lee DS, Hyun SW, J. Ind. Eng. Chem., 7(6), 449 (2001)
  •  
  • 16. Kim YC, Park SJ, Lee JR, J. Korean Ind. Eng. Chem., 8(6), 960 (1997)
  •  
  • 17. Lee SD, An BH, Lee KK, Kim WH, J. Korean Ind. Eng. Chem., 5, 640 (2004)
  •  
  • 18. Zhong ZK, Guo QP, Polymer, 39(15), 3451 (1998)
  •  
  • 19. ASTM D1002 edition, ASTM International (2005)
  •  
  • 20. Chen YC, Chiu WY, Polymer, 42(12), 5439 (2001)
  •  
  • 21. Barton JM, Hamerton I, Howlin BJ, Jones JR, Liu S, Polymer, 30, 1929 (1998)
  •  
  • 22. Park SJ, Heo GY, Lee JR, Hong YT, Choi KY, Polym.(Korea), 26(5), 599 (2002)
  •  
  • 23. Lee SD, Ahn BH, Lee KG, Kim WH, J. Korean Ind. Eng. Chem., 15(6), 646 (2004)
  •  
  • 24. Park SH, Phuong TV, Song HW, Park KN, Kim BM, Choe Y, J. Korean Ind. Eng. Chem., 19(5), 471 (2008)
  •  
  • 25. Kim MY, Kim WH, Choe Y, Park JM, Park IS, Polym. Int., 51, 1353 (2002)
  •  
  • 26. Kim D, Beak JO, Choe Y, Kim W, Korean J. Chem. Eng., 22(5), 755 (2005)
  •  
  • 27. Hwang S, Kim M, Kim D, Choe Y, Kim W, J. Chem. Eng. Jpn., 38(8), 623 (2005)
  •  
  • 28. Choe Y, Kim W, Macromol. Res., 10(5), 259 (2002)
  •  
  • 29. Noeske M, Degenhardt J, Strudthoff S, Lommatzsch U, Int. J. Adhes. Adhes., 24, 171 (2004)
  •  
  • 30. Green MD, Guild FJ, Adams RD, Int. J. Adhes. Adhes., 81, 22 (2002)
  •  
  • 31. Liston E, Martinu L, Wertheimer MR, J. Adhes. Sci. Technol., 7, 1091 (1993)
  •  
  • 32. Tang, Kwon OJ, Lu N, Choi HS, Sur. Coat. Technol., 195, 298 (2005)
  •  
  • 33. Song HW, Park KN, Park SH, Kang HS, Phuong TV, Nguyen TN, Natarajan SK, Kim WH, Kim BM, Choe Y, Polymer(Korea)submitted.
  •  
  • 34. Ooi SK, Cook WD, Simon GP, Such CH, Polymer, 41(10), 3639 (2000)
  •  
  • 35. Kim DS, Lee JK, Choi EJ, Polym.(Korea), 23(4), 569 (1999)
  •  
  • Polymer(Korea) 폴리머
  • Frequency : Bimonthly(odd)
    ISSN 0379-153X(Print)
    ISSN 2234-8077(Online)
    Abbr. Polym. Korea
  • 2023 Impact Factor : 0.4
  • Indexed in SCIE

This Article

  • 2009; 33(4): 290-296

    Published online Jul 25, 2009

  • 10.7317/pk.
  • Received on Oct 24, 2008
  • Revised on Nov 30, -0001
  • Accepted on Feb 6, 2009

Correspondence to

  • E-mail: