Article
  • Study for Mechanical Properties of Electroless (Ni/Au) Plated Monodisperse Polymer Particles
  • Kim DO, Jin JH, Shon WI, Oh SH
  • 무전해 (니켈/금) 도금 처리된 단분산 가교고분자 미립자의 기계적 물성 연구
  • 김동옥, 진정희, 손원일, 오석헌
References
  • 1. Watanabe I, Fujinawa T, Arifuku M, Fujii M, Gotoh Y9th Int’l Symposium on Advanced Packing Materials (2004)
  •  
  • 2. Joshi R, Microelectr. J., 29, 343 (1998)
  •  
  • 3. Chang S, Jou J, Hsieh A, Chen T, Chang C, Wang Y, Hung C, Microelectron. Reliab., 41, 2001 (2001)
  •  
  • 4. Rizvi M, Chan Y, Sharif A, Solder. Surf. Mt. Tech., 17, 40 (2005)
  •  
  • 5. Sarkar G, Mridha S, Chong T, Yuen W, Kwan S, J. Mater. Process. Technol., 89-90, 484 (1999)
  •  
  • 6. Chan Y, Luk D, Microelectron. Reliab., 42, 1185 (2002)
  •  
  • 7. Chan Y, Luk D, Microelectron. Reliab., 42, 1195 (2002)
  •  
  • 8. Wu Y, Alam M, Chan Y, Wu B, Microelectron. Reliab., 44, 295 (2004)
  •  
  • 9. Seppala A, Ristolainen E, Microelectron. Reliab., 44, 639 (2004)
  •  
  • 10. Uddin M, Alam M, Chan Y, Chan H, Microelectron. Reliab., 44, 505 (2004)
  •  
  • 11. Goward JM, Whalley DC, Williams DJ, Microelectr. Int., 37, 55 (1995)
  •  
  • 12. Whalley DC, Mannan SH, Williams DJ, Assembly Autom., 17, 66 (1997)
  •  
  • 13. Oguibe CN, Mannan SH, Whalley DC, Williams DJ, IEEE T. Compon. Pack B, 21, 235 (1998)
  •  
  • 14. Saiuchi K, Kohara M, Yamada K, Kanki KUS Patent 5,486,941 (1996)
  •  
  • 15. Saiuchi K, Kohara M, Yamada K, Kanki KUS Patent 5,615,031 (1997)
  •  
  • 16. Park JK, Chung PMKorea Patent 10-2004-002183 (2004)
  •  
  • 17. Kim DO, Jin JH, Shon WI, Oh SH, Polym.(Korea), 30(4), 332 (2006)
  •  
  • 18. Kim DO, Shon WI, Jin JH, Oh SH, Polym.(Korea), 31(3), 184 (2007)
  •  
  • 19. Iacovangelo CD, Plating & Surface FinishingSept., 77 (1995)
  •  
  • 20. Hagiwara K, Watanabe J, Honma H, Plating & Surface FinishingApril, p.74 (1997)
  •  
  • 21. Motizuki I, Izawa K, Watanabe J, Honma H, Trans. IMF, 77, 41 (1997)
  •  
  • Polymer(Korea) 폴리머
  • Frequency : Bimonthly(odd)
    ISSN 0379-153X(Print)
    ISSN 2234-8077(Online)
    Abbr. Polym. Korea
  • 2023 Impact Factor : 0.4
  • Indexed in SCIE

This Article

  • 2007; 31(5): 410-416

    Published online Sep 25, 2007

  • 10.7317/pk.
  • Received on May 7, 2007
  • Revised on Nov 30, -0001
  • Accepted on Jul 10, 2007

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