Article

References

1. Pecht MG, Nguyen LT, Hakim EBPlastic-encapsulated Microelectronics: Materials, Processes, Quality, Reliability, and Application, John Wiley & Sons, Inc., New York, Chap. 2 (1995)
2. Present State and Future Prospect of 2005 Electronics Polymer Materials (Japanese), Fuji Chimera Research Institute, Inc., Tokyo (2005)
3. Shibata CPolymeric Materials and Microwave Properties, in Development of Plastic Materials for Microwave Applications(Japanese), F. Baba, Editor, CMC, Tokyo, Chap. 2 (2005)
4. Igarashi KJapanese Patent 354754 (2001)
5. Usami Y, Demura S, Fujimura K, Takahashi KJapanese Patent 82063 (2003)
6. Komuku I, Hirai M, Imada TJapanese Patent 240654 (2001)
7. Hirai T, Imura TJapanese Patent 252951 (2003)
8. Ishii K, Norisue Y, Hiramatsu S, Miyamoto MJapanese Patent 206333 (2003)
9. Yoshida TJapanese Patent 256137 (2002)
10. Suwa TJapanese Patent 69156 (2002)
11. Gilman JW, Appl. Clay Sci., 15, 31 (1999)
12. Lebaron PC, Wang Z, Pinnavaia TJ, Appl. Clay Sci., 15, 11 (1999)
13. Lee SU, Oh IH, Lee JH, Choi KY, Lee SG, Polym.(Korea), 29(3), 271 (2005)
14. Lan T, Kaviratna PD, Pinnavaia TJ, J. Phys. Chem. Solid, 57, 1005 (1996)
15. Nam JD, Hwang SD, Choi HR, Lee JH, Kim KJ, Heo S, Smart Mater. Struct., 14, 87 (2005)
16. Ku CC, Liepins RElectrical Properties of Polymers: Chemical Principles, Hanser Publishers, New York, p. 335 (1987)
17. Williams EPM, Seferis JC, Wittman CL, Parker GA, Lee JH, Nam JD, J. Polym. Sci. B: Polym. Phys., 42(1), 1 (2004)

Polymer(Korea) 폴리머
Frequency : Bimonthly(odd)
ISSN 0379-153X(Print)
ISSN 2234-8077(Online)
Abbr. Polym. Korea
2023 Impact Factor : 0.4
Indexed in SCIE