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References
  • 1. Hamid MR, Amin MB, Maadhah AGHandbook of Polymer Degradation, Marcel Dekker, New York (1992)
  •  
  • 2. Gao Z, Kaneko T, Amasaki I, Nakada M, Polym. Degrad. Stabil., 80, 269 (2003)
  •  
  • 3. Li XG, Huang MR, Polym. Int., 48, 387 (1999)
  •  
  • 4. Suzuki M, Wilkie CA, Polym. Degrad. Stabil., 47, 217 (1995)
  •  
  • 5. Serrano E, Zubeldia A, Larranaga M, Remiro P, Mondragon I, Polym. Degrad. Stabil., 83, 495 (2004)
  •  
  • 6. Friedman HL, J. Polym. Sci. C., 6, 183 (1967)
  •  
  • 7. Freeman ES, Carroll B, J. Phys. Chem., 62, 394 (1958)
  •  
  • 8. Coats AW, Redferm JP, Nature, 201, 68 (1964)
  •  
  • 9. Chang WL, J. Appl. Polym. Sci., 53(13), 1759 (1994)
  •  
  • 10. Flynn JH, Wall LA, J. Polym. Sci. Polym. Lett. Ed., 4, 329 (1966)
  •  
  • 11. Reich L, J. Polym. Sci. C., 6, 183 (1964)
  •  
  • 12. Kim SD, Park JK, Thermochim. Acta, 264(-), 137 (1995)
  •  
  • 13. Kissinger HE, Anal. Chem., 29, 1072 (1957)
  •  
  • 14. Hernandez-Sanchez F, Vara-Graziano R, J. Appl. Polym. Sci., 46, 571 (1992)
  •  
  • 15. Li XG, Huang MR, Polym. Int., 46, 289 (1998)
  •  
  • 16. Petrovic ZS, Zavargo ZZ, J. Appl. Polym. Sci., 32, 4353 (1986)
  •  
  • 17. Ozawa T, J. Therm. Anal., 2, 301 (1970)
  •  
  • 18. Nelson AAccelerated Testing-Statistical Models, Test Plans, and Data Analysis, Wiley, New York (1990)
  •  
  • 19. Billmeyer FW, Saltzman MPrinciple of Color Technology, 2nd Ed., John Wiley and Sons, New York (1981)
  •  
  • Polymer(Korea) 폴리머
  • Frequency : Bimonthly(odd)
    ISSN 0379-153X(Print)
    ISSN 2234-8077(Online)
    Abbr. Polym. Korea
  • 2022 Impact Factor : 0.4
  • Indexed in SCIE

This Article

  • 2005; 29(5): 508-517

    Published online Sep 25, 2005

  • 10.7317/pk.
  • Received on Aug 3, 2005
  • Revised on Nov 30, -0001
  • Accepted on Sep 22, 2005

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