Article

Preparation and Thermal Conductivity of Poly(organosiloxane) Rubber Composite with Low Hardness
Kang DW, Yeo HG
저경도 Poly(organosiloxane) Rubber Composite의 제조와 열전도 특성
강두환, 여학규

References

1. Mori T, Senda M, IEICE Trans. Commun., 83, 600 (2000)
2. Joo J, Lee CY, J. Appl. Phys., 88, 513 (2000)
3. Yama Kawa, et al., Japan Pat. 8-325457 (1996)
4. Degree DCU.S. Pat. 4,574,879 (1986)
5. Smith WO, Phys. Rev., 34, 1272 (1929)
6. Lewis TB, Nielsen LE, J. Appl. Polym. Sci., 14, 1449 (1970)
7. Dinger DR, Flunk JEParticle Packing ; Review of Packing theories, Fine Particle Socity, 13th Annual Meeting, Chicago (1982)
8. Ortega FS, Pileggi RG, Sepulveda P, Pandolfelli VC, Am. Ceram. Soc. Bull., 78, 106 (1999)
9. Elsbernd CS, Spinu M, Krukonis VJ, Gallagher PM, Mohanty DK, McGrath JESilicone-based Polymer Science, American Chemical Society, Washington, p. 145 (1990)
10. Mcgrath JE, Riffle JS, Yilgor L, Banthia AKACS Symp. Ser., No. 211, Chapter 2 (1983)
11. Kang DW, Lee KS, Yeo HG, Shim JS, J. Korean Ind. Eng. Chem., 13(6), 594 (2002)
12. Gilbert AR, Kantor SW, J. Polym. Sci., 40, 35 (1959)
13. Park SG, Ko SW, J. Korean Fiber Soc., 32, 494 (1995)
14. Edgar E. Bostick, et al., U. S. Patent 3,337,497 (1967)
15. Buchner W, Schliebs R, Winter G, Buchel KHIndustrial Inorganic chemistry, Freedom Academy Pub. Co., Seoul, p. 359 (1995)

Polymer(Korea) 폴리머
Frequency : Bimonthly(odd)
ISSN 0379-153X(Print)
ISSN 2234-8077(Online)
Abbr. Polym. Korea
2023 Impact Factor : 0.4
Indexed in SCIE