Article
  • Nondestructive Damage Sensitivity of Carbon Nanotube and Nanofiber/Epoxy Composites using Electro-Micromechanical Technique and Acoustic Emission
  • Kim DS, Park JM, Kim TW
  • 전기적-미세역학 시험법과 음향 방출을 이용한 탄소 나노튜브와 나노섬유 강화 에폭시 복합재료의 비파괴 손상 감지능
  • 김대식, 박종만, 김태욱
References
  • 1. Thostenson ET, Ren Z, Chou TW, Compos. Sci. Technol., 61, 1889 (2002)
  •  
  • 2. Fujiwara A, Iijima R, Suematsu H, Kataura H, Maniwa Y, Suzuki S, Achiba Y, Physica B, 323, 227 (2002)
  •  
  • 3. Lourie O, Wagner HD, Compos. Sci. Technol., 59, 975 (1999)
  •  
  • 4. Pipes RB, Hubert P, Compos. Sci. Technol., 62, 419 (2002)
  •  
  • 5. Allaoui A, Bai S, Cheng HM, Bai B, Compos. Sci. Technol., 62, 1993 (2002)
  •  
  • 6. Sandler J, Shaffer MSP, Prasse T, Bauhofer W, Schulte K, Windle AH, Polymer, 40(21), 5967 (1999)
  •  
  • 7. Bubert H, Haiber S, Brandl W, Marginean G, Heintze M, Bruser V, Diamond Relat. Mater., 12, 811 (2003)
  •  
  • 8. Park C, Ounaies Z, Watson KA, Chem. Phys. Lett., 364, 303 (2002)
  •  
  • 9. Kymakis E, Alexandou I, Amaratunga GAJ, Synth. Met., 127, 59 (2002)
  •  
  • 10. Li YH, Wei J, Zhang X, Xu C, Wu D, Lu L, Wei B, Chem. Phys. Lett., 365, 95 (2002)
  •  
  • 11. Feller JF, Linossier I, Grohens Y, Mater. Lett., 57, 64 (2002)
  •  
  • 12. Vil Akova J, Saha P, Quadrat O, Eur. Polym. J., 38, 2343 (2002)
  •  
  • 13. Chen GH, Wu CL, Weng WG, Wu DJ, Yan WL, Polymer, 44(6), 1781 (2003)
  •  
  • 14. Park JM, Lee SI, Kim KW, Yoon DJ, J. Colloid Interface Sci., 237(1), 80 (2001)
  •  
  • 15. Wang S, Lee SI, Chung DDL, Park JM, Compos. Interfaces, 8, 435 (2001)
  •  
  • 16. Wang X, Chung DDL, Compos. Interfaces, 5, 277 (1998)
  •  
  • 17. Park JM, Kong JW, Kim DS, Lee JR, Polym.(Korea), 27(3), 189 (2003)
  •  
  • Polymer(Korea) 폴리머
  • Frequency : Bimonthly(odd)
    ISSN 0379-153X(Print)
    ISSN 2234-8077(Online)
    Abbr. Polym. Korea
  • 2022 Impact Factor : 0.4
  • Indexed in SCIE

This Article

  • 2004; 28(4): 285-290

    Published online Jul 25, 2004

  • 10.7317/pk.
  • Received on Mar 10, 2004
  • Revised on Nov 30, -0001
  • Accepted on May 6, 2004

Correspondence to

  • E-mail: