Article
  • Preparation and Physical Properties of High-Solid Coatings by Acrylic Resins and Hexamethylene Diisocyanate-Biuret
  • You HJ, Chung DJ, Park HS, Kim SK, Im WB
  • 아크릴수지와 헥사메틸렌 디이소시아네이트-뷰렛에 의한 고 고형분 도료의 제조 및 도막물성 연구
  • 유혁재, 정동진, 박홍수, 김성길, 임완빈
References
  • 1. Parsons PSurface Coatings: Raw Materials and Their Usage, 3rd. Ed., New South Wales University Press, Kensington, Australia, p. 395-397 (1995)
  •  
  • 2. Eaton RF, Lamb KT, J. Coat. Technol., 68(860), 49 (1996)
  •  
  • 3. Noren GK, Lin SC, Eldridge E, J. Coat. Technol., 57(720), 61 (1985)
  •  
  • 4. Avci S, Patel NM, Leo LD, Reiter RHU.S. Patent, 5,312,877 (1993)
  •  
  • 5. Exsted BJ, Urban MW, J. Appl. Polym. Sci., 47, 2019 (1993)
  •  
  • 6. Ha KJM.S. Dissertation, Myongji Univ., Yongin, Korea (1998)
  •  
  • 7. deMeijer M, Prog. Org. Coat., 43, 217 (2001)
  •  
  • 8. Fujii T, Obata H, Yakita S, Kume A, Serizawa H, Komatsu TU.S. Patent, 5,929,140A (1999)
  •  
  • 9. You HJ, Chung DJ, Hahm HS, Park HS, Kim SK, J. Korean Oil Chem. Soc., 20, 237 (2003)
  •  
  • 10. Union Carbide Co., Tone M-100 Monomer Caprolactone Acrylate Monomer for Radiation Curing, UCAR Coatings Resins, CT 06817-0001, Danbury (1987)
  •  
  • 11. Gupta MK, J. Coat. Technol., 67(846), 53 (1995)
  •  
  • 12. Park HS, Polym.(Korea), 16(6), 693 (1992)
  •  
  • 13. Mark HF, Bikales NM, Overberger CG, Menges G, Kroschwitz JIEncyclopedia of Polymer Science and Engineering, Vol. 1, p. 656, Wiley, New York (1985)
  •  
  • 14. Macosko CW, Br. Polym. J., 17, 239 (1985)
  •  
  • 15. Lapasin R, Mangano P, Torriano G, Rheol. Acta, 25, 426 (1986)
  •  
  • 16. Roller MB, J. Coat. Technol., 54(691), 33 (1982)
  •  
  • 17. Park JH, Shin YJ, Polym.(Korea), 21(6), 894 (1997)
  •  
  • Polymer(Korea) 폴리머
  • Frequency : Bimonthly(odd)
    ISSN 0379-153X(Print)
    ISSN 2234-8077(Online)
    Abbr. Polym. Korea
  • 2023 Impact Factor : 0.4
  • Indexed in SCIE

This Article

  • 2004; 28(3): 273-280

    Published online May 25, 2004

  • 10.7317/pk.
  • Received on Jan 29, 2004
  • Revised on Nov 30, -0001
  • Accepted on May 24, 2004

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