Article
  • Properties of Poly(oxymethylene)/Modified Poly[styrene-b-(ethylene-1-butene)-b-styrene] Triblock Copolymer Blends
  • Jeon HU, Kim SW, Kim GH, Kim I, Ha CS
  • 폴리(옥시메틸렌)/개질 폴리[스티렌-b-(에틸렌-1-부텐)-b-스티렌] 삼블록 공중합체 블렌드의 물성
  • 전현욱, 김승우, 김규현, 김일, 하창식
References
  • 1. Paul DR, Newman SPolymer Blends, Academic London (1978)
  •  
  • 2. Utracki LAPolymer Alloys and Blends, Hanser, New York (1989)
  •  
  • 3. Ehrig RJPlastics Recycling, Hanser, New York (1992)
  •  
  • 4. Coleman MM, Graf JF, Painter PCSpecific Interactions and the Miscibility of Polymer Blends, Technomic Publishing Co. Inc., Lancaster (1991)
  •  
  • 5. Sullivan MJ, Weiss RA, Polym. Eng. Sci., 32, 517 (1992)
  •  
  • 6. Gao Z, Molnar A, Morin FG, Eisenberg A, Macromolecules, 25, 6460 (1992)
  •  
  • 7. Soundararajan S, Shit SC, Polym. Testing, 20, 313 (2001)
  •  
  • 8. Lin XD, Cheung WL, J. Mater. Process. Technol., 63, 476 (1997)
  •  
  • 9. Dziadur W, Mater. Charact., 46, 131 (2001)
  •  
  • 10. Guo HF, Packirisamy S, Gvozdic NV, Meier DJ, Polymer, 38(4), 785 (1997)
  •  
  • 11. Kin JH, Soh YS, Polym.(Korea), 23(6), 869 (1999)
  •  
  • 12. Hage E, Hale W, Keskkula H, Paul DR, Polymer, 38(13), 3237 (1997)
  •  
  • 13. Boggreve RJM, Gaymans RJ, Eichenwild HM, Polymer, 30, 71 (1989)
  •  
  • 14. Passaglia E, Ghetti S, Picchioni F, Ruggeri G, Polymer, 41(12), 4389 (2000)
  •  
  • 15. Kim SJ, Shin BS, Hong JL, Cho WJ, Ha CS, Polymer, 42(9), 4073 (2001)
  •  
  • 16. Wang XD, Feng W, Li HQ, Ruckenstein E, Polymer, 43(1), 37 (2002)
  •  
  • 17. Seo YS, Lee JH, Hwang SS, Kim KU, Hong SI, Kim HS, Polym.(Korea), 16(4), 407 (1992)
  •  
  • 18. Chiang CR, Chang FC, Polymer, 38(19), 4807 (1997)
  •  
  • 19. Majumdar B, Paul DR, Oshinski AJ, Polymer, 38(8), 1787 (1997)
  •  
  • 20. Picchioni F, Aglietto M, Passaglia E, Ciardelli F, Polymer, 43(11), 3323 (2002)
  •  
  • Polymer(Korea) 폴리머
  • Frequency : Bimonthly(odd)
    ISSN 0379-153X(Print)
    ISSN 2234-8077(Online)
    Abbr. Polym. Korea
  • 2023 Impact Factor : 0.4
  • Indexed in SCIE

This Article

  • 2004; 28(2): 162-169

    Published online Mar 25, 2004

  • 10.7317/pk.
  • Received on Jun 30, 2003
  • Revised on Nov 30, -0001
  • Accepted on Mar 11, 2004

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