Article
  • Preparation and Characterization of Ipriflavone-Loaded Poly(L-lactide-co-glycolide) Scaffold for Tissue Engineered Bone
  • Jang JW, Lee B, Han CW, Lee IW, Lee HB, Khang G
  • 조직공학적 골을 위한 이프리플라본을 함유한 다공성 지지체의 제조 및 그 특성
  • 장지욱, 이봉, 한창환, 이일우, 이해방, 강길선
References
  • 1. Khang G, Lee SJ, Lee HBPolymer-cell Interaction, in Tissue Engineering; Concepts and Application, J.J. Yoo and I. Lee, Editors, Korean Med. Pub. Co., Seoul, p. 297 (2002)
  •  
  • 2. Khang G, Rhee JM, Lee I, Lee HB, Polym. Sci. Technol., 12(4), 527 (2001)
  •  
  • 3. Lee I, Khang G, Lee HB, Polym. Sci. Technol., 10(6), 782 (1999)
  •  
  • 4. Khang G, Jo I, Lee JH, Lee I, Lee JM, Lee HB, Polym. Sci. Technol., 10(5), 640 (1999)
  •  
  • 5. Wintermantel E, Mayer J, Blum J, Eckert KL, Luscher P, Mathey M, Biomaterials, 17, 83 (1996)
  •  
  • 6. Baldwin SP, Saltzman WM, Adv. Drug Deliv. Rev., 33, 71 (1998)
  •  
  • 7. Khang G, Rhee JM, Lee I, Lee HB, Polym. Sci. Technol., 13(2), 226 (2002)
  •  
  • 8. Wintermantel E, Bruinink A, Eckert KH, Ruffieux K, Petitmermet M, Mayer JTissue Engineering Supported with Structured Biocompatible Materials; Goals and Achievements, M.O. Speidel and P. Uggowitzer, Editors, Mater. Med., p. 1 (1998)
  •  
  • 9. Putnam AJ, Mooney DJ, Nat. Med., 2, 824 (1996)
  •  
  • 10. Minabe M, J. Periodontol, 53, 171 (1991)
  •  
  • 11. Khang G, Lee I, Lee HB, Lee SJ, Polym. Sci. Technol., 13(1), 4 (2002)
  •  
  • 12. Khang G, Lee HB, Regenerative Medicine, 1, 114 (2002)
  •  
  • 13. Whang K, Thomas CH, Healy KE, Nuber G, Polymer, 36(4), 837 (1995)
  •  
  • 14. Sittinger M, Bujia J, Rotter N, Reitzel O, Minuth WW, Burmester GR, Biomaterials, 17, 237 (1996)
  •  
  • 15. Athanasiou KA, Niederauer GG, Agrawal CM, Biomaterials, 17, 93 (1996)
  •  
  • 16. Habal MB, Clin. Orthop., 188, 239 (1984)
  •  
  • 17. Lane JM, Sandhu HS, Orthop. Clin. North Am., 18, 213 (1997)
  •  
  • 18. Jergesen HE, Chua J, Kao RT, Kaban LB, Clin. Orthop., 268, 253 (1991)
  •  
  • 19. Rath NC, Reddi AH, Nature, 278, 855 (1979)
  •  
  • 20. Khang G, Lee I, Rhee JM, Lee HB, Polym. Sci. Technol., 12(2), 239 (2001)
  •  
  • 21. Khang G, Park CS, Rhee JM, Lee SJ, Lee YM, Choi MK, Lee HB, Lee I, Korea Polym. J., 9(5), 267 (2001)
  •  
  • 22. Khang G, Rhee JM, Shin P, Kim IY, Lee B, Lee SJ, Lee YM, Lee HB, Lee I, Macromol. Res., 10(3), 158 (2002)
  •  
  • 23. Choi MG, Khang G, Lee IW, Rhee JM, Lee HB, Polym.(Korea), 25(3), 318 (2001)
  •  
  • 24. Jeon EK, Shim JY, Whang HJ, Khang G, Jo I, Lee I, Rhee JM, Lee HB, Biomater. Res., 5, 23 (2001)
  •  
  • 25. Jeon EK, Whang HJ, Khang G, Lee I, Rhee JM, Lee HB, Polym.(Korea), 25(6), 893 (2001)
  •  
  • 26. Kim HS, Lee I, Lee JM, Han CW, Sung JH, Park MY, Khang G, Lee HB, J. Korea Soc. Endocrinology, 17, 206 (2002)
  •  
  • 27. Lee SJ, Lee DH, Khang G, Lee YM, Lee HB, Macromol. Chem. Symp., 15, 201 (2002)
  •  
  • 28. Brandi MD, J. Medicine, 95, 593 (1993)
  •  
  • 29. Rondelli I, Acerbi D, Ventura P, J. Clin. Pharm. Res., 4, 183 (1991)
  •  
  • 30. Agnusdei D, Adami S, Cervetti R, Bone Miner., 19, S43 (1992)
  •  
  • 31. Melis GB, Paoletti AM, Bartolini R, Bone Miner., 19(S), 49 (1992)
  •  
  • 32. Freed LE, Marquis JC, Nohria A, Emmanual J, Mikos AG, Langer R, J. Biomed. Mater. Res., 11, 27 (1993)
  •  
  • 33. Marques AP, Reis RL, Hunt JA, Biomaterials, 23, 1471 (2002)
  •  
  • 34. Ritter HL, Drake LC, Ind. Eng. Chem., 17, 782 (1945)
  •  
  • 35. Smith DM, hua DW, Earl WL, MRS Bull., 19, 44 (1994)
  •  
  • 36. Mikos AG, Sarakinos G, Leite SM, Vacanti JP, Langer R, Biomaterials, 14, 323 (1993)
  •  
  • 37. Martini M, Formigli L, Tonelli P, Giannelli M, Amunni F, Naldi D, Bradi ML, Orlandini SZ, Orlandini GE, Calcif. Tissue Int., 63, 312 (1998)
  •  
  • Polymer(Korea) 폴리머
  • Frequency : Bimonthly(odd)
    ISSN 0379-153X(Print)
    ISSN 2234-8077(Online)
    Abbr. Polym. Korea
  • 2023 Impact Factor : 0.4
  • Indexed in SCIE

This Article

  • 2003; 27(3): 226-234

    Published online May 25, 2003

  • 10.7317/pk.
  • Received on Feb 19, 2003
  • Revised on Nov 30, -0001
  • Accepted on Apr 22, 2003

Correspondence to

  • E-mail: