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References
  • 1. Cameron NR, Sherrington DC, Adv. Polym. Sci., 126, 163 (1996)
  •  
  • 2. Barby D, Haq ZEuropean Patent, 0.060,138 to Unilever (1982)
  •  
  • 3. Williams JM, Langmuir, 4, 44 (1988)
  •  
  • 4. Williams JM, Wrobleski DA, Langmuir, 4, 656 (1988)
  •  
  • 5. Young AT, Moreno DK, Marsters RG, J. Vac. Sci. Technol., 20, 1094 (1982)
  •  
  • 6. Stokes RJ, Evans DFFundamentals of Interfacial Engineering, Wiley, New York (1997)
  •  
  • 7. Aubert JH, Clough RL, Polymer, 26, 2047 (1985)
  •  
  • 8. Williams JM, Gray AJ, Wilkerson MH, Langmuir, 6, 437 (1990)
  •  
  • 9. Schoo HFM, Challa G, Rowatt B, Sherrington DC, React. Polym., 16, 125 (1991)
  •  
  • 10. Cameron NR, Sherrington DC, Ando I, Kurosu H, J. Mater. Chem., 6, 719 (1996)
  •  
  • 11. Ottens M, Leene G, Beenackers AACM, Cameron N, Sherrington DC, Ind. Eng. Chem. Res., 39(2), 259 (2000)
  •  
  • 12. Bhumgara Z, Filtr. Sep., 32(3), 245 (1995)
  •  
  • 13. Wu JP, Kim SN, Polym.(Korea), 22(4), 642 (1998)
  •  
  • 14. Sergienko AY, Tai HW, Narkis M, Silverstein MS, J. Appl. Polym. Sci., 84(11), 2018 (2002)
  •  
  • 15. Hoisington MA, Duke JR, Apen PG, Polymer, 38(13), 3347 (1997)
  •  
  • 16. Duke JR, Hoisington MA, Langlois DA, Benicewicz BC, Polymer, 39(18), 4369 (1998)
  •  
  • 17. Mercier A, Deleuze H, Mondain-Monval O, React. Funct. Polym., 46, 67 (2000)
  •  
  • 18. Tai H, Sergienko A, Silverstein MS, Polymer, 42(10), 4473 (2001)
  •  
  • 19. Nielsen LE, Landel RFMechanical Properties of Polymers and Composites, Marcel Dekker, New York (1994)
  •  
  • 20. Boyde AScanning Electron Microscopy, ed. by O.C. Wells, McGraw-Hill, New York (1974)
  •  
  • Polymer(Korea) 폴리머
  • Frequency : Bimonthly(odd)
    ISSN 0379-153X(Print)
    ISSN 2234-8077(Online)
    Abbr. Polym. Korea
  • 2023 Impact Factor : 0.4
  • Indexed in SCIE

This Article

  • 2002; 26(6): 759-766

    Published online Nov 25, 2002

  • 10.7317/pk.
  • Received on Apr 24, 2002
  • Revised on Nov 30, -0001
  • Accepted on Sep 18, 2002

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