Article
  • Thermal Lamination of Polyethylene Film on Aluminum by Surface Modification
  • Cho DL, Yun TS
  • 표면개질을 이용한 폴리에틸렌 필름과 알루미늄간의 열융착
  • 조동련, 윤타송
References
  • 1. Wu SPolymer Interface and Adhesion, chap. 9, M. Dekker, New York (1982)
  •  
  • 2. Perrins LE, Pettett K, Plast. Polym., 39, 391 (1971)
  •  
  • 3. Nowak S, Haerri HP, Schlapbach L, Vogt J, Surf. Interface Anal., 16, 418 (1990)
  •  
  • 4. Papirer E, Wu D, Nanse G, Schultz JChemically Modified Surfaces, H.A. Mottola and J.R. Steinmetz Eds., Elsevier, Amsterdam (1992)
  •  
  • 5. Strobel M, Dunatov C, Strobel JM, Lyons CS, Perron SJ, Morgen MC, J. Adhes. Sci. Technol., 3, 321 (1989)
  •  
  • 6. Gerenser LJ, J. Adhes. Sci. Technol., 1, 303 (1987)
  •  
  • 7. Sydney L, Ebner SRU.S. Patent, 4,543,268 (1985)
  •  
  • 8. Bodo P, Sundgren JE, J. Appl. Phys., 60, 1161 (1986)
  •  
  • 9. Zeiler T, Pfeffer P, Kurner M, Munstedt H, Macromol. Symp., 126, 267 (1997)
  •  
  • 10. Decker C, Zahouily K, Macromol. Symp., 129, 99 (1998)
  •  
  • 11. Plueddmann EPSilane Coupling Agent,, M. Dekker, New York (1982)
  •  
  • 12. Gutowski WFundamentals of Adhesion, Plenum Pub. Co., New York (1991)
  •  
  • 13. Kaelble DH, Uy KC, J. Adhes., 2, 50 (1970)
  •  
  • 14. Cho DL, Claesson PM, Golander CG, Johansson K, J. Appl. Polym. Sci., 41, 1373 (1990)
  •  
  • 15. Yasuda HPlasma Polymerization, Academic Press, New York (1985)
  •  
  • Polymer(Korea) 폴리머
  • Frequency : Bimonthly(odd)
    ISSN 0379-153X(Print)
    ISSN 2234-8077(Online)
    Abbr. Polym. Korea
  • 2023 Impact Factor : 0.4
  • Indexed in SCIE

This Article

  • 2001; 25(4): 594-601

    Published online Jul 25, 2001

  • 10.7317/pk.
  • Received on Dec 13, 2000
  • Revised on Nov 30, -0001
  • Accepted on Nov 30, -0001

Correspondence to

  • E-mail: