Article
  • A Study on the Cure Behavior of Epoxy Molding Compound
  • Yun SY, Oh M, Park NJ
  • Epoxy Molding Compound의 경화거동에 관한 연구
  • 윤상영, 오명숙, 박내정
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  • Polymer(Korea) 폴리머
  • Frequency : Bimonthly(odd)
    ISSN 0379-153X(Print)
    ISSN 2234-8077(Online)
    Abbr. Polym. Korea
  • 2023 Impact Factor : 0.4
  • Indexed in SCIE

This Article

  • 2000; 24(6): 837-844

    Published online Nov 25, 2000

  • 10.7317/pk.
  • Received on Nov 30, -0001
  • Revised on Nov 30, -0001
  • Accepted on Nov 30, -0001

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