Article
  • A Study on the Toughening of Ternary Polymer Blends
  • Yang S, Char K, Lim JC, Kim H, Ryu SH
  • 삼성분계 고분자 블렌드의 강인화에 관한 연구
  • 양세우, 차국헌, 임종철, 김형수, 류승훈
References
  • 1. Bucknall CBToughened Plastics, Applied Science, Barking (1977)
  •  
  • 2. Collyer AARubber Toughened Engineering Plastics, Chapman & Hall, New York (1994)
  •  
  • 3. Boyer RF, Keskkula HEncyclopedia of Science and Technology, ed. by N. Bikales, Wiley, New York (1970)
  •  
  • 4. Turley SG, Keskkula H, Polymer, 21, 466 (1980)
  •  
  • 5. Donald AM, Kramer EJ, J. Appl. Polym. Sci., 27, 3729 (1982)
  •  
  • 6. Keskkula HAdv. Chem. Ser., ed. by C.K. Riew, vol. 222, p. 289, Am. Chem. Soc., Washington, D.C. (1989)
  •  
  • 7. Wu S, Polymer, 26, 1855 (1985)
  •  
  • 8. Borggreve RJM, Gaymans RJ, Schuijer J, Housz JFI, Polymer, 28, 1489 (1987)
  •  
  • 9. Wu S, J. Appl. Polym. Sci., 35, 549 (1988)
  •  
  • 10. Ueno K, Murayama TU.S. Patent, 4,315,086 (1982)
  •  
  • 11. Kim JH, Char K, Kim H, Ryu SHpaper in preparation
  •  
  • 12. Kim J, Char K, Korean J. Rheol., 5(2), 170 (1993)
  •  
  • 13. Sundararaj U, Macosko CW, Macromolecules, 28(8), 2647 (1995)
  •  
  • 14. Baker RE, Saleem M, Polymer, 28, 2057 (1987)
  •  
  • 15. Fowler MW, Baker WE, Polym. Eng. Sci., 28, 1427 (1988)
  •  
  • 16. Ostenbrink AJ, Dijkstra K, Wiegersma S, Wal AVD, Gaymans RJProc. 8. Int. Conf. Deformation, Yield and Fracture of Polymers, p. 50, Cambridge (1991)
  •  
  • 17. Oshinski AJ, Keskkula H, Paul DR, Polymer, 33, 268 (1992)
  •  
  • 18. Michler GH, Acta Polym., 44, 113 (1993)
  •  
  • 19. Sue HJ, Yee AF, J. Mater. Sci., 26, 3449 (1991)
  •  
  • 20. Hobbs SY, Dekkers MEJ, J. Mater. Sci., 24, 1316 (1989)
  •  
  • Polymer(Korea) 폴리머
  • Frequency : Bimonthly(odd)
    ISSN 0379-153X(Print)
    ISSN 2234-8077(Online)
    Abbr. Polym. Korea
  • 2023 Impact Factor : 0.4
  • Indexed in SCIE

This Article

  • 1999; 23(4): 523-532

    Published online Jul 25, 1999

  • 10.7317/pk.
  • Received on Nov 30, -0001
  • Revised on Nov 30, -0001
  • Accepted on Nov 30, -0001

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