Article
  • Synthesis of PCS-co-MPS Ceramic Precursor with Platinum Catalyst and Its Pyrolysis
  • Hwang TS, Lee JT, Woo HG
  • 백금촉매에 의한 PCS-co-MPS 세라믹 전구체의 합성과 열분해 특성
  • 황택성, 이존태, 우희권
References
  • 1. Hasegawa Y, Okamura K, J. Mater. Sci. Lett., 4, 356 (1985)
  •  
  • 2. Yajima S, Hayashi J, Omori M, Chem. Lett., 931, 931 (1975)
  •  
  • 3. Yajima S, Okamura K, Hayashi J, Omori M, J. Am. Ceram. Soc., 59, 324 (1976)
  •  
  • 4. Hasegawa Y, Iimura M, Yjima S, J. Mater. Sci., 15, 720 (1980)
  •  
  • 5. Okave Y, Hejo J, Kato A, J. Less. Commun. Mater., 68, 29 (1979)
  •  
  • 6. Hirai T, Goto T, Ksji T, Yogyo Kyokai Shi, 91, 502 (1983)
  •  
  • 7. Hase T, Suzuki M, Yogyo Kyokai Shi, 68, 541 (1978)
  •  
  • 8. Hasegawa Y, Okamura K, J. Mater. Sci., 18, 3633 (1983)
  •  
  • 9. Yajima S, Hasegawa Y, Hayashi J, Imura M, J. Mater. Sci., 13, 2569 (1978)
  •  
  • 10. Hasegawa Y, Imura M, Yajima S, J. Mater. Sci., 15, 720 (1980)
  •  
  • 11. Hwang TS, Lim JH, Woo HG, Polym.(Korea), 22(2), 194 (1998)
  •  
  • 12. Hwang TS, Polym.(Korea), 22(5), 708 (1998)
  •  
  • 13. Bacque E, Pillat JP, Birot M, Dunogues J, Macromolecules, 21, 34 (1988)
  •  
  • 14. Ganicz T, Stanczyk W, Bialeckaflorjanczyk E, Sledzinska I, Polymer, 37(18), 4167 (1996)
  •  
  • 15. Fritz G, Grobe J, Kummer D, Adv. Inorg. Chem. Radiochem., 7, 349 (1965)
  •  
  • 16. Bouillon E, Langlais F, Pailler R, Naslain R, Cruege F, Huong PV, J. Mater. Sci., 26, 1333 (1991)
  •  
  • 17. Martin HP, Muller E, Richter R, Roewer G, Brendler E, J. Mater. Sci., 32(5), 1381 (1997)
  •  
  • 18. Narisawa M, Shimoda M, Okamura K, Sugimoto M, Seguchi T, Bull. Chem. Soc. Jpn., 68(4), 1098 (1995)
  •  
  • Polymer(Korea) 폴리머
  • Frequency : Bimonthly(odd)
    ISSN 0379-153X(Print)
    ISSN 2234-8077(Online)
    Abbr. Polym. Korea
  • 2022 Impact Factor : 0.4
  • Indexed in SCIE

This Article

  • 1999; 23(2): 197-203

    Published online Mar 25, 1999

  • 10.7317/pk.
  • Received on Nov 30, -0001
  • Revised on Nov 30, -0001
  • Accepted on Nov 30, -0001

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