Article

Analysis of Polymer Materials in Epoxy Molding Compounds by GPC and Reversed Phase HPLC
Yun SY, Oh M, Park NJ
GPC와 역상 HPLC에 의한 에폭시 봉지제 중 고분자 물질 분석
윤상영, 오명숙, 박내정

References

1. Manzione LTPlastic Packaging of Microelectronic Devices, p. 68, van Nostrand Reinhold, N.Y. (1990)
2. Soane DS, Martynenko ZEncapsulations and Packaging of Integrated Circuits, in Polymers in Microelectronics, Fundamentals and Applications, p. 213, Elsevier, N.Y. (1989)
3. Licari JJ, Hugues LAHandbook of Polymer Coatings for Electronics, p. 14, Noyes Publications, Park Ridge, N.Y. (1990)
4. Hadad DW, SAMPE J., 14, 4 (1978)
5. Dark WA, Conrad EC, Crossman LW, J. Chromatogr., 91, 247 (1974)
6. Shiono S, Karino I, Ishimura A, Enomoto J, J. Chromatogr., 193, 243 (1980)
7. Martin JR, Johnson JF, Cooper AR, J. Macromol. Sci.-Rev. Macromol. Chem. Phys., C8(1), 57 (1972)
8. Brown RPHandbook of Plastics Test Methods, 2nd ed., Godwin/PRI, London (1981)
9. Van Krevelen DWProperties of Polymers: Correlation with Chemical Structure, p. 17, Elsevier, Amsterdam (1972)
10. Podzimek S, Hroch L, J. Appl. Polym. Sci., 47, 2005 (1993)
11. McCrary TJAm. Lab., 86, Jan. (1985)
12. Hagnauer GL, Setton I, J. Liq. Chromatogr., 1, 55 (1978)
13. Zucconi TD, Humphrey JS, Polym. Eng. Sci., 16, 11 (1976)
14. Batzer H, Zahir SA, J. Appl. Polym. Sci., 21, 1843 (1977)
15. Antal I, Fuzes L, Samay G, Csillag L, J. Appl. Polym. Sci., 26, 2783 (1981)
16. Hangauer GL, Ind. Res. Dev., Apr., 128 (1981)
17. Hangauer GL, Dunn DA, J. Appl. Polym. Sci., 26, 1837 (1981)

Polymer(Korea) 폴리머
Frequency : Bimonthly(odd)
ISSN 0379-153X(Print)
ISSN 2234-8077(Online)
Abbr. Polym. Korea
2022 Impact Factor : 0.4
Indexed in SCIE