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Submitted (~23-08-31)
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Submitted (23-09-01~)
Article
Preparation of Polypropylene Hollow Fiber Membrane via Thermally-Induced Phase Separation and Stretching Process
Kim JH, Ryu JB, Song K, Kim SS
열유도 상분리 및 연신공정을 이용한 폴리프로필렌 중공사막의 제조
김진호, 유종범, 송기국, 김성수
References
1. Kesting RESynthetic Polymeric Membranes, McGraw-Hill, New York (1792)
2. Mulder MBasic Principles of Membrane Technology, p. 59, Kluwer Academic, The Natherlands (1991)
3. Pinnau I, Koros WJ,
J. Polym. Sci.
,
31
, 419 (1993)
4. Lloyd DR, Kinzer KE, Tseng HS,
J. Membr. Sci.
,
52
, 239 (1990)
5. Lloyd DR, Kim SS, Kinzer KE,
J. Membr. Sci.
,
64
, 1 (1991)
6. Kim SS, Lloyd DR,
J. Membr. Sci.
,
64
, 13 (1991)
7. Lim GBA, Kim SS, Ye Q, Wang YF, Lloyd DR,
J. Membr. Sci.
,
64
, 31 (1991)
8. Caneba GT, Soong DS,
Macromolecules
,
18
, 2538 (1985)
9. Schaaf P, Lots B, Wittmann JC,
Polymer
,
28
, 193 (1987)
10. Berghmans S, Berghmans H, Meijer HE,
J. Membr. Sci.
,
116
(2), 171 (1996)
11. Kim JJ, Jang TS, Kwon YD, Kim UY, Kim SS,
J. Membr. Sci.
,
93
(3), 209 (1994)
12. Kim JJ, Hwang JR, Kim UY, Kim SS,
J. Membr. Sci.
,
108
(1-2), 25 (1995)
13. Shipman GHU.S. Patent, 4,539,256 (1985)
14. Seita Y, Nagaki S, Tatebe K, Kido KU.S. Patent, 5,354,470 (1994)
15. Kopp CV, Streeton RJW, Khoo PSU.S. Patent, 5,395,570 (1995)
16. Cho IS, Kim JH, Kim SS,
Korea Polym. J.
,
5
(3), 191 (1997)
17. Kim JH, Kang MS, Cho IS, Kim SS,
Korea Polym. J.
,
5
(1), 44 (1997)
18. Mulder MBasic Principles of Membrane Technology, p. 117, Kluwer Academic, The Netherlands (1991)
Polymer(Korea)
폴리머
Frequency : Bimonthly(odd)
ISSN 0379-153X(Print)
ISSN 2234-8077(Online)
Abbr. Polym. Korea
2023 Impact Factor : 0.4
Indexed in SCIE
This Article
1998; 22(5): 849-860
Published online Sep 25, 1998
10.7317/pk.
Received on Nov 30, -0001
Revised on Nov 30, -0001
Accepted on Nov 30, -0001
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