Article
  • Synthesis of High Molecular Weight PPS by Copolymerization and Additives
  • Park LS, Lee TH, Kwak KD, Cha IH, Lee SY
  • 첨가제 및 공중합을 이용한 고분자량 PPS의 합성 및 물성
  • 박이순, 이태형, 곽규대, 차일훈, 이서용
References
  • 1. Margolis JMEngineering Thermoplastics, Marcel Dekker (1985)
  •  
  • 2. Sandler SR, Karo WPolymer Synthesis, vol. 3, Academic Press (1980)
  •  
  • 3. Tsuchida E, Nishide H, Yamamoto K, Yoshida S, Macromolecules, 20, 2030 (1987)
  •  
  • 4. Tsuchida E, Nishide H, Yamamoto K, Yoshida S, Macromolecules, 20, 2315 (1987)
  •  
  • 5. Tsuchida E, Suzuki F, Shouji E, Yamamoto K, Macromolecules, 27(4), 1057 (1994)
  •  
  • 6. Fagerburg DR, Watkins JJ, Lawrence PB, Macromolecules, 24, 4033 (1991)
  •  
  • 7. Wang YF, Hay AS, Macromolecules, 29(14), 5050 (1996)
  •  
  • 8. Edmonds JT, Hill HWU.S. Patent, 3,354,129 (1967)
  •  
  • 9. Rohlfing RGU.S. Patent, 3,717,620 (1973)
  •  
  • 10. Wejchan-Judek M, Perkowska B, Polym. Degrad. Stabil., 38, 261 (1992)
  •  
  • 11. Campbell RW, Scoggins LEU.S. Patent, 3,869,434 (1975)
  •  
  • 12. Campbell RWU.S. Patent, 3,966,688 (1976)
  •  
  • 13. Lee SC, Park LS, Polym.(Korea), 19(5), 685 (1995)
  •  
  • 14. Park LS, Lee SC, Nam JI, J. Polym. Sci. A: Polym. Chem., 34(11), 2117 (1996)
  •  
  • 15. Park LS, Lee SC, Nam JI, Polymer, 37(8), 1339 (1996)
  •  
  • 16. Park LS, Lee SC, Lee TH, Jeon JY, Polym.(Korea), 21(3), 369 (1997)
  •  
  • 17. Campbell RW, Yelton HDU.S. Patent, 4,024,118 (1977)
  •  
  • 18. Campbell RW, Edmonds JTU.S. Patent, 4,038,259 (1977)
  •  
  • 19. Campbell RWU.S. Patent, 3,919,177 (1975)
  •  
  • 20. Jeon JY, Park LS, Lee SC, Lee THKorea Patent, 97-53766 (1997)
  •  
  • Polymer(Korea) 폴리머
  • Frequency : Bimonthly(odd)
    ISSN 0379-153X(Print)
    ISSN 2234-8077(Online)
    Abbr. Polym. Korea
  • 2022 Impact Factor : 0.4
  • Indexed in SCIE

This Article

  • 1998; 22(2): 217-222

    Published online Mar 25, 1998

  • 10.7317/pk.
  • Received on Nov 30, -0001
  • Revised on Nov 30, -0001
  • Accepted on Nov 30, -0001

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