Article
  • The Effect of Blocking Layer Thickness on Dielectric Properties during the Curing of Epoxy/Glass Fiber Prepregs as Measured by a Remote Single Surface Sensor
  • Kim H, Ahn KJ, Ha J, Char K
  • 에폭시/유리섬유 프리프레그의 경화공정에서 차폐막 두께에 따른 분리형 단평면 센서로 측정된 유전물성의 영향에 대한 연구
  • 김홍경, 안규종, 하종민, 차국헌
References
  • 1. Kranbuehl DE, Eichinger D, Hamilton T, Clark R, Polym. Eng. Sci., 31, 56 (1991)
  •  
  • 2. Kranbuehl DE, Delos S, Yi E, Mayer J, Jarvie T, Winfree W, Hou T, Polym. Eng. Sci., 26, 338 (1986)
  •  
  • 3. Kranbuehl DE, Hood D, Rogozinski J, Limburg W, ACs Prepr., 36, 773 (1995)
  •  
  • 4. Stephan F, Boiteux G, Seytre G, Ulanski J, ACS Prepr., 36, 771 (1995)
  •  
  • 5. Senturia SD, Sheppard NF, Adv. Polym. Sci., 80, 1 (1986)
  •  
  • 6. Radhakrishnan S, Saini DR, Polym. Eng. Sci., 33, 125 (1993)
  •  
  • 7. Maffezzoli AM, Peterson L, Seferis JC, Polym. Eng. Sci., 33, 75 (1993)
  •  
  • 8. Sheppard NF, Senturia SD, Polym. Eng. Sci., 26, 354 (1986)
  •  
  • 9. Sanjana ZN, Polym. Eng. Sci., 6, 373 (1986)
  •  
  • 10. Mackinnon AJ, Jenkins SD, McGrail PT, Pethrick RA, Macromolecules, 25, 3492 (1992)
  •  
  • 11. Ellis BChemistry and Technology of Epoxy Resin, Blackie Academic & Professional, Glasgow (1993)
  •  
  • 12. Ahn KJ, Chung KM, Eom YS, Kim H, Char K, J. Korean Soc. Compos. Mater., 7, 87 (1994)
  •  
  • 13. Kim H, Eom YS, Chung KM, Ahn KJ, Char K, Polym.(Korea), 19(3), 265 (1995)
  •  
  • 14. Kim H, Ahn KJ, Hong J, Char K, Polym.(Korea), 20(6), 1114 (1996)
  •  
  • 15. Hedvig PDielectric Spectroscopy of Polymers, John Wiley & Sons, New York (1977)
  •  
  • 16. Day DR, Rewis TJ, Lee HL, Senturia SD, J. Adhes., 18, 73 (1985)
  •  
  • Polymer(Korea) 폴리머
  • Frequency : Bimonthly(odd)
    ISSN 0379-153X(Print)
    ISSN 2234-8077(Online)
    Abbr. Polym. Korea
  • 2022 Impact Factor : 0.4
  • Indexed in SCIE

This Article

  • 1997; 21(5): 851-860

    Published online Sep 25, 1997

  • 10.7317/pk.
  • Received on Nov 30, -0001
  • Revised on Nov 30, -0001
  • Accepted on Nov 30, -0001

Correspondence to

  • E-mail: