Article
  • Adhesion Prorerties with Moisture Absorption between High Silica Loaded epoxy Molding Compound and Leadframe
  • Oh KK, Moon KS, Yoon HG, Moon TJ, Ryu JH, Kim JM, Kim JG
  • 실리카 고충전 에폭시 수지 조성물과 리드프레임과의 흡습에 따른 접착 특성
  • 오경근, 문경식, 윤호규, 문탁진, 유제홍, 김진모, 김조균
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  • Polymer(Korea) 폴리머
  • Frequency : Bimonthly(odd)
    ISSN 0379-153X(Print)
    ISSN 2234-8077(Online)
    Abbr. Polym. Korea
  • 2023 Impact Factor : 0.4
  • Indexed in SCIE

This Article

  • 1997; 21(5): 812-820

    Published online Sep 25, 1997

  • 10.7317/pk.
  • Received on Nov 30, -0001
  • Revised on Nov 30, -0001
  • Accepted on Nov 30, -0001

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