Article

Silica Filler Effect on the Characteristic of Molding Compounds for Electronic Packaging
Ko M, Kim M
실리카 충진제에 의한 반도체 팩키징 캄파운드의 물성 거동
고민진, 김명환

References

1. Wong CP, Adv. Polym. Sci., 84, 65 (1988)
2. Tummala RR, Rymaszewski EJ, Klopfenstein AGMicroelectronics Packaging Handbook, Van Nostrand Reinhold, New York (1989)
3. Kinjo N, Ogata M, Nish K, Kaneda A, Adv. Polym. Sci., 88, 1 (1989)
4. Fukuzawa I, Ishiguro S, Nanbu S, Proc. IRPS, 192 (1985)
5. Lin R, Blackshear E, Seriky P, Proc. IRPS, 82 (1988)
6. Umehara N, Inomata S, Umeda Y, Naeshiro M, Sakamoto KIEEE 45th ECTC, 470 (1995)
7. Jugita KProc. 18th R & M Symposium, 31 (1988)
8. Yang JC, Leong CW, Goh JS, Yen CKIEEE 46th ECTC, 48 (1996)
9. Nakamura Y, Yamaguchi M, Kitayama A, Okubo M, Matsumoto T, Polymer, 32, 2221 (1991)
10. Eguchi S, Nagai A, Ishii T, Numara S, Ogata M, Nishi K, Murakami GSEMICON Singapore, 209 (1994)
11. Gallo AA, Tubbs TR, IEEE Trans. CPMT-Part A, 8, 646 (1995)
12. Cho TJ, Lee KJ, Lee MH, Ahn SH, Oh SYIEEE 46th ECTC, 931 (1996)
13. Ogata M, Kinjo N, Kawata T, J. Appl. Polym. Sci., 48, 583 (1993)

Polymer(Korea) 폴리머
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