Article
  • Effect of Compatibilization on the Crystallization Behavior and the Physical Properties of Polypropylene/Polyamide Blends
  • Kim JH, KIm HI, Song HY, Kim HC, Lee KY
  • 폴리프로필렌/폴리아미드 블렌드의 결정화 거동 및 물성에 대한 상용화의 영향
  • 김진현, 김형일, 송해영, 김현철, 이기윤
References
  • 1. Paul DR, Newman SPolymer Blends, Academic Press, New York (1978)
  •  
  • 2. Han CDMultiphase Flow in Polymer Processing, Academic Press, New York (1981)
  •  
  • 3. Utracki LAPolymer Alloys and Blends, Hanser, Munich (1989)
  •  
  • 4. Collyer AARubber Toughened Engineering Plastics, Chapman & Hall, London (1994)
  •  
  • 5. Bucknall CBToughened Plastics, Applied Science Publishers, London (1977)
  •  
  • 6. Kurauchi T, J. Mater. Sci., 19, 1669 (1984)
  •  
  • 7. Koo KK, Inoue T,Miyasaki K, Polym. Eng. Sci., 25, 741 (1985)
  •  
  • 8. Kim SC, Brown HR, J. Mater. Sci., 22, 2589 (1987)
  •  
  • 9. Dekkers ME, Heikens D, J. Mater. Sci. Lett., 3, 307 (1984)
  •  
  • 10. Xanthos M, Polym. Eng. Sci., 28, 1392 (1988)
  •  
  • 11. Folkes MJ, Hope PSPolymer Blends and Alloys, Chapman & Hall, London (1993)
  •  
  • 12. Ishida H, Macromol. Chem. Macromol. Symp., 50, 157 (1991)
  •  
  • 13. Aref-Azar A, Hay JN, Marsden BJ, Walker N, J. Polym. Sci. B: Polym. Phys., 18, 637 (1980)
  •  
  • 14. Baitoul M, Saint-Guirons H, Xans P, Monge P, Eur. Polym. J., 17, 1281 (1981)
  •  
  • 15. Ghijsels A, Groesbeek N, Yip CW, Polymer, 23, 1913 (1982)
  •  
  • 16. Frensch H, Jungnickel BJ, Colloid Polym. Sci., 267, 16 (1989)
  •  
  • 17. Ikkala OT, Holstimiettinen RM, Seppala J, J. Appl. Polym. Sci., 49, 1165 (1993)
  •  
  • 18. Kim HI, Ahn BH, Lee DH, Yoo YS, Polym.(Korea), 18(3), 316 (1994)
  •  
  • 19. Wu S, Polym. Eng. Sci., 27, 335 (1987)
  •  
  • Polymer(Korea) 폴리머
  • Frequency : Bimonthly(odd)
    ISSN 0379-153X(Print)
    ISSN 2234-8077(Online)
    Abbr. Polym. Korea
  • 2023 Impact Factor : 0.4
  • Indexed in SCIE

This Article

  • 1996; 20(5): 791-797

    Published online Sep 25, 1996

  • 10.7317/pk.
  • Received on Nov 30, -0001
  • Revised on Nov 30, -0001
  • Accepted on Nov 30, -0001

Correspondence to

  • E-mail: