Article
  • Evaluation of Peeling Property of Polyisoprene-Based Pressure Sensitive Adhesive
  • You Sub Kim, Hui Jae Cho, Yong Chan Jung*,† , and Soo Yeol Lee

  • Department of Materials Science Engineering, Chungnam National University, 99 Daehakro, Yuseong-gu, Daejeon 34134, Korea
    *Creative Future Laboratory, KEPCO Research Institute, 105 Munjiro, Yuseong-gu, Daejeon 34056, Korea

  • 폴리이소프렌 감압 접착제의 박리특성 평가
  • 김유섭 · 조희재 · 정용찬*,† · 이수열

  • 충남대학교 신소재공학과, *한전 전력연구원 창의미래연구소

References
  • 1. R. W. Jaszewski, H. Schift, B. Schnyder, A. Schneuwly, and P. Groning, Appl. Surf. Sci., 143, 301 (1999).
  •  
  • 2. S. Park, C. Padeste, H. Schift, and J. Gobrecht, Microelectr. Eng., 67, 252 (2003).
  •  
  • 3. A. J. Snyder, C. A. Siedlecki, and K. Milner, U.S. Patent US2005/0228491 A1 (2005).
  •  
  • 4. KEPCO, Technical Standard of KEPCO, ES-9905-0015 (2017).
  •  
  • 5. https://pubchem.ncbi.nlm.nih.gov.
  •  
  • 6. KS T 1028, Testing methods of pressure sensitive adhesive tapes and sheets (2014).
  •  
  • 7. KEPCO, Korea Patent 10-2018-0043147 (2018).
  •  
  • 8. J. H. Park and N. H. Lee, Korea Patent 10-2010-0004428 (2010).
  •  
  • 9. K. S. Jung, Korea Patent 10-2016-0053888 (2016).
  •  
  • 10. Samsung Electro-mechanics Co., Korea Patent 10-2014-0005692 (2014).
  •  
  • 11. Kipae E&T Co., Korea Patent 20-2006-0006269 (2006).
  •  
  • 12. A. D. Crocombe and R. D. Adams, J. Adhesion, 12, 127 (1981).
  •  
  • 13. A. D. Crocombe and R. D. Adams, J Adhesion, 13, 241 (1982).
  •  
  • 14. T. Yamaguchi, H. Morita, and M. Doi, Eur. Phys. J. E, 20, 7 (2006).
  •  
  • 15. S. Sekine and T. Kawakatsu, Adv. Nat. Sci: Nanosci. Nanotechnol., 4, 025016 (2013).
  •  
  • 16. A. Ozer, Int. J. Adhes. Adhes., 62, 14 (2015).
  •  
  • 17. T. Sugihara and T. Enomoto, Precis. Eng., 36, 229 (2012).
  •  
  • Polymer(Korea) 폴리머
  • Frequency : Bimonthly(odd)
    ISSN 0379-153X(Print)
    ISSN 2234-8077(Online)
    Abbr. Polym. Korea
  • 2023 Impact Factor : 0.4
  • Indexed in SCIE

This Article

  • 2019; 43(1): 1-9

    Published online Jan 25, 2019

  • 10.7317/pk.2019.43.1.1
  • Received on Apr 12, 2018
  • Revised on Aug 18, 2018
  • Accepted on Oct 2, 2018

Correspondence to

  • Yong Chan Jung* , and Soo Yeol Lee
  • Department of Materials Science Engineering, Chungnam National University, 99 Daehakro, Yuseong-gu, Daejeon 34134, Korea
    *Creative Future Laboratory, KEPCO Research Institute, 105 Munjiro, Yuseong-gu, Daejeon 34056, Korea

  • E-mail: 007mrjung@gmail.com, sylee2012@cnu.ac.kr