Article
  • A Study on the Low-Temperature Cure Characteristics of Acid Anhydride-Based Epoxy Resin System for High-Temperature Cure
  • Gal YS, Park BY, Kim HG, Chung SK, Jung B
  • 고온경화용 산무수물계 에폭시 수지조성의 저온경화특성 연구
  • 갈영순, 박병열, 김형근, 정상기, 정발
References
  • 1. Lubin GHandbook of Composites, Van Nostrand Reinhold Company, N.Y. (1982)
  •  
  • 2. Peters ST, Humphrey WD, Foral RFFilament Winding Composite Structure Fabrication, SAMPE (1991)
  •  
  • 3. Reinhart TJEngineered Materials Handbook Vol. 1, Composites, ASM International. OHIO (1987)
  •  
  • 4. Weatherhead RGFRP Technology, Applied Science (1980)
  •  
  • 5. Rosato DV, Grove CSFilament Winding: Its Development, Manufacture, Applications, and Design, Interscience Publishers, N.Y. (1964)
  •  
  • 6. Sheppard LM, Adv. Mater. Process, 132, 31 (1987)
  •  
  • 7. Moquet G, Lamalles JAIAA-81-1462
  •  
  • 8. Munjal AK, SAMPE Quarterly, Jan., 1 (1986)
  •  
  • 9. Sigur WA, SAMPE Quarterly, Jan., 25 (1986)
  •  
  • 10. Munjal AKASM/ESD Advanced Composites Conference, 309 (1985)
  •  
  • 11. Tackett EW, Merrell GA, Kulkarni SBAIAA-84-1351
  •  
  • 12. Vogt C, Munson WO, Wolcost FEAIAA-81-1417
  •  
  • 13. Sayles DC26th SAMPE Symposium, April 28-30, 325 (1981)
  •  
  • 14. Kaszyk JThe Epoxy Resin Formulations Training Manual, SPI, N.Y. (1984)
  •  
  • 15. Mazenko DM, Jexsen GA, McCormick PJ, SAMPE J., May, 28 (1987)
  •  
  • 16. Hollaway L, Romhi A, Gunn M, Compos. Structures, 16, 125 (1990)
  •  
  • 17. Adams RD, Peppiatt NA, J. Adhes., 9, 1 (1977)
  •  
  • 18. Chester RJ, Roberts JD, Int. J. Adhes. Adhes., 9(3), 129 (1989)
  •  
  • 19. Bradley WLApplication of Fracture MEchanics to Composite Materials, Ed. by K. Friedrich, pp. 159-187, Elsevier (1989)
  •  
  • Polymer(Korea) 폴리머
  • Frequency : Bimonthly(odd)
    ISSN 0379-153X(Print)
    ISSN 2234-8077(Online)
    Abbr. Polym. Korea
  • 2023 Impact Factor : 0.4
  • Indexed in SCIE

This Article

  • 1995; 19(1): 55-64

    Published online Jan 25, 1995

  • 10.7317/pk.
  • Received on Nov 30, -0001
  • Revised on Nov 30, -0001
  • Accepted on Nov 30, -0001

Correspondence to

  • E-mail: