Article
  • Surface Modification of Polyimide Films
  • Oh KS, Kim KY, Kim SH, Park JK, Im SS
  • 폴리이미드 필름의 표면개질
  • 오관식, 김기영, 김성훈, 박재기, 임승순
References
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  • 2. Lupinski JH, Moore RSPolymeric Materials for Electronics Packaging and Interconnection, eds. by J.H. Lupinski and R.S. Moore, ACS, Washington D.C. (1989)
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  • 3. Lee KW, Kowalczyk SPWet-Process Surface Modification of Polyimides, Adhesion Improvement, in Metallization of Polymers, American Chemical Society, Chap. 13, p. 79-195, Washington D.C. (1990)
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  • Polymer(Korea) 폴리머
  • Frequency : Bimonthly(odd)
    ISSN 0379-153X(Print)
    ISSN 2234-8077(Online)
    Abbr. Polym. Korea
  • 2022 Impact Factor : 0.4
  • Indexed in SCIE

This Article

  • 1995; 19(1): 40-46

    Published online Jan 25, 1995

  • 10.7317/pk.
  • Received on Nov 30, -0001
  • Revised on Nov 30, -0001
  • Accepted on Nov 30, -0001

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