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References
  • 1. Chien JCWPolyacetylene, Academic Press, New York (1984)
  •  
  • 2. Skotheim TAHandbook of Conducting Polymers, Marcel Dekker, New York, Vol. 1 and 2 (1986)
  •  
  • 3. Simionescu CI, Percec V, Prog. Polym. Sci., 8, 133 (1982)
  •  
  • 4. Chauser MG, Rodionov YM, Misin VM, Cherkashin MI, Russ. Chem. Rev., 45, 695 (1976)
  •  
  • 5. Gibson HW, Porchan JMEncyclopedia Polymer Science and Engineering, 2nd. John Wiley & Sons, New York, Vol. 1, p. 87 (1984)
  •  
  • 6. Masuda T, Hasegawa K, Higashimura T, Macromolecules, 7, 728 (1974)
  •  
  • 7. Masuda T, Higashimura T, Adv. Polym. Sci., 81, 121 (1987)
  •  
  • 8. Katz TJ, Lee SJ, J. Am. Chem. Soc., 102, 422 (1980)
  •  
  • 9. Gibson HW, Bailey FC, Epstein AJ, Rommelmann H, Kaplan S, Harbour J, Yang XQ, Tanner DB, Pochan JM, J. Am. Chem. Soc., 105, 4417 (1983)
  •  
  • 10. Choi SK, Makromol. Chem. Symp., 33, 145 (1990)
  •  
  • 11. Park JW, Lee JH, Cho HN, Choi SK, Macromolecules, 26, 1191 (1993)
  •  
  • 12. Jin SH, Choi SJ, Ahn W, Cho HN, Choi SK, Macromolecules, 26, 1487 (1993)
  •  
  • 13. Kang KL, Kim SH, Choi KY, Cho HN, Choi SK, Macromolecules, 26, 4539 (1993)
  •  
  • 14. Eglinton G, Galbraith AR, J. Chem. Soc., 889 (1959)
  •  
  • 15. Ryoo MS, Lee WC, Choi SK, Macromolecules, 23, 1191 (1990)
  •  
  • 16. Takahashi S, Kuroyama Y, Sonogashira K, Hagihara N, Synthesis, 627 (1980)
  •  
  • 17. Huynh C, Linstrumelle G, Tetrahedron, 44, 6337 (1988)
  •  
  • Polymer(Korea) 폴리머
  • Frequency : Bimonthly(odd)
    ISSN 0379-153X(Print)
    ISSN 2234-8077(Online)
    Abbr. Polym. Korea
  • 2022 Impact Factor : 0.4
  • Indexed in SCIE

This Article

  • 1994; 18(3): 297-302

    Published online May 25, 1994

  • 10.7317/pk.
  • Received on Nov 30, -0001
  • Revised on Nov 30, -0001
  • Accepted on Nov 30, -0001

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