Note
  • Dynamic Mechanical Properties of Thermoset Blends Made from Epoxy Resin and Styrene
  • Gal YS, Jung B
  • 에폭시수지와 스티렌으로부터 제조한 열경화성 블렌드의 동력학적 특성
  • 갈영순, 정발
References
  • 1. May CAEpoxy Resins, Chemistry and Technology, Marcel Dekker, Inc., N.Y. (1988)
  •  
  • 2. Dusek KEpoxy Resins and Composites I, II, III, Springer-Verlag, Berlin (1986)
  •  
  • 3. Munjal AK, SAMPE Quarterly, Jan., 1 (1986)
  •  
  • 4. Rosato DV, Grove CSFilament Winding: Its Development, Manufacture, Applications, and Design, John Wiley & Sons, Inc., N.Y. (1964)
  •  
  • 5. Shibley AMHandbook of Composites, ed. by G. Lubin, Chapter 16, Van Nostrand Reinhold Company, N.Y. (1982)
  •  
  • 6. Newhouse NI, Humphrey WD, SAMPE J.March/April, 12 (1986)
  •  
  • 7. Moquet G, Lamalle JAIAA-81-1462, AIAA/SAE/ASME 17th Joint Propulsion Conference, July 27-29, Colorado Springs, Colorado (1981)
  •  
  • 8. Peters ST, Humphrey WDComposites, ed. by T.J. Reinhart, p. 503, ASM International (1987)
  •  
  • 9. Christensen N, Wolcott E29th SAMPE Symposium, April 3-5, p. 1335 (1984)
  •  
  • 10. Chiao TT, Jessop ES, Newey HASAMPE Quarterly, October, p. 28 (1974)
  •  
  • 11. McCLEAN-ANDERSON Filament Winding Workshop VI, October 4-5 (1988)
  •  
  • 12. Zaske OCHandbook of Thermoset Plastics, ed. by S.H. Goodman, Chapter 4, Noyes Publications, New Jersey (1986)
  •  
  • 13. White MN, Cowley TWSAMPE Quarterly, October, p. 43 (1990)
  •  
  • 14. Gal YS, Park BY, Kang HC, Jung B, J. Appl. Polym. Sci.to submitted
  •  
  • 15. Woo EM, Seferis JC, Bravenec LD, J. Mater. Sci., 26, 1691 (1991)
  •  
  • 16. Keenan JD, Seferis JC, Quinlivan JT, J. Appl. Polym. Sci., 24, 2375 (1979)
  •  
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This Article

  • 1992; 16(4): 505-508

    Published online Jul 25, 1992

  • 10.7317/pk.
  • Received on Nov 30, -0001
  • Revised on Nov 30, -0001
  • Accepted on Nov 30, -0001

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