Article
  • Curing Behavior of an Epoxy Resin with Hardener Formulations Composed of MDI-phenol Adduct and Diethylenetriamine

  • Daejung Kim, Dai-Soo Lee, and Youn-Sik Lee†

  • Division of Chemical Engineering, Nanomaterials Processing Research Center, Chonbuk National University, 567 Baekje-Daero, Deokjin-gu, Jeonju, Jeonbuk 54898, Korea

  • MDI-페놀 부가물과 Diethylenetriamine으로 구성된 경화제 조성물에 의한 에폭시 수지의 경화 거동

  • 김대중 · 이대수 · 이연식†

  • 전북대학교 화학공학부

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  • Polymer(Korea) 폴리머
  • Frequency : Bimonthly(odd)
    ISSN 0379-153X(Print)
    ISSN 2234-8077(Online)
    Abbr. Polym. Korea
  • 2023 Impact Factor : 0.4
  • Indexed in SCIE

This Article

  • 2018; 42(1): 1-7

    Published online Jan 25, 2018

  • 10.7317/pk.2018.42.1.1
  • Received on Jan 23, 2017
  • Revised on May 18, 2017
  • Accepted on Aug 22, 2017

Correspondence to

  • Youn-Sik Lee

  • Division of Chemical Engineering, Nanomaterials Processing Research Center, Chonbuk National University, 567 Baekje-Daero, Deokjin-gu, Jeonju, Jeonbuk 54898, Korea

  • E-mail: yosklear@jbnu.ac.kr