N,N''- Bis(carboxyphenyl) - 3,3'',4,4''- benzophenonetetracarboxylic diimide(BCBTD) and bis(4-carboxyphenyl) diphenyl silane (BCDPS) were Polymerized with orthometa-, and para-phenylenediamines. The thermal stabilities of the copolymers were measured by using thermogravimetric analyzer (TCA). The polymers containing BCBTD were more thermally stable than the other copolymers. The polymers derived from the para- and meta-phenylenediamines were somewhat more heat-resistant compared with the products prepared from the ortho-phenylenediamine. The solubility of the polyimide-amide containing silicones has been also examined in the solvents such as N,N''-dimethylformamide(DMF), N-methyIpyrrolidone(NVP), dimethylsulfoxide(DMSO), and N,N''-dimethylacetamide(DMAC).

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