Jin Seob Kim, Young Sil Lee*, Kwan Han Yoon† , and Jong Hun Han**
Dept. of Chemical Engineering, Kumoh National Institute of Technology, Gumi 39177, Korea
*Industry-Academic Cooperation Foundation, Kumoh National Institute of Technology, Gumi 61186, Korea
**School of Chemical Engineering, Chonnam National University, Gwangju 39177, Korea
금오공과대학교 화학공학과, *금오공과대학교 산학협력단, **전남대학교 화학공학과
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Polycarbonate/copper-exfoliated graphite nanoplatelets (PC/Cu-xGnP) composites were prepared. Prior to the preparation of the composite, two types of Cu-xGnP hybrid powder were prepared: one is fully inserted xGnP and the other is partially inserted xGnP in Cu-flakes. TEM images of hybrid powder showed the partially and fully inserted xGnP in Cu-flakes. On comparing with the mechanical properties and thermal conductivity, PC/Cu-xGnP composite was better than those of PC/Cu and PC/xGnP composites. The thermal conductivity of the partially inserted PC/Cu-xGnP composite was higher than that of the fully inserted PC/Cu-xGnP composite at the same filler concentration. On the other hand, the fully inserted PC/Cu-xGnP composite was superior to the partially inserted PC/Cu-xGnP composite in terms of mechanical properties.
본 연구에서는 폴리카보네이트/구리-팽창흑연 나노판(PC/Cu-xGnP) 복합체가 제조되었다. PC 복합체 제조에 앞서 두 종류의 Cu-xGnP 하이브리드 입자가 제조 되었는데 하나는 xGnP가 구리에 완전 삽입된 Cu-xGnP 입자이고 다른 하나는 부분 삽입된 Cu-xGnP 입자이다. 두 종류의 하이브리드 입자의 삽입 정도는 투과 전자 현미경으로 확인되었다. 구리와 xGnP를 이용하여 제조된 PC/Cu 및 PC/xGnP 복합체와 비교하여 Cu-xGnP로 제조된 PC/Cu-xGnP 복합체의 기계적 성질과 열전도도가 더 우수하였다. 부분 삽입된 PC/Cu-xGnP 복합체의 열전도도는 완전 삽입된 PC/Cu-xGnP 복합체보다 모든 함량에서 높게 관찰되었다. 반면에 기계적인 성질에서는 완전 삽입된 PC/Cu-xGnP 복합체가 부분 삽입된 PC/Cu-xGnP 복합체보다 우수하였다.
Keywords: polycarbonate, copper-exfoliated graphite nanoplatelets, composite, thermal conductivity, mechanical properties.
2021; 45(4): 560-567
Published online Jul 25, 2021
Dept. of Chemical Engineering, Kumoh National Institute of Technology, Gumi 39177, Korea