A series of polyimide (PI) was prepared by reacting 4,4'-(hexafluoroisopropylidene)-diphthalic anhydride(6FDA) as the anhydride and bis(3-aminophenyl) sulfone (APS), bis[4-(3-aminophenoxy)-phenyl] sulfone (BAPS), 2,2-bis(4-aminophenyl)-hexafluoropropane (6FPD), 2,2-bis[4-(4-aminophenoxy)-phenyl]hexafluoropropane (6FBAPP), 2,2'-bis(trifluoromethyl)benzidine (TFDB), or 1,4-phenylenediamine (PDA) as the diamine. Residual stress behaviors were detected in-situ during thermal imidization of the polyimide precursors using a thin film stress analyzer (TFSA), and interpreted with respect to their morphology. According to the molecular orientation and packing order, the residual stress varied from 23.1 to 12.5 MPa, decreased with increasing chain rigidity. The thermal properties of the PI films were investigated using differential scanning calorimetry (DSC), thermogravimetric analysis (TGA), and thermomechanical analysis (TMA). Their optical properties were measured by ultraviolet-visible spectrophotometer (UV-vis), and spectrophotometry. The properties of PI films were found to be strongly dependent upon the morphological structure. However, trade-offs between residual stress and optical properties were identified.

이무수물인 4,4'-(hexafluoroisopropylidene)-diphthalic anhydride(6FDA)에 bis(3-aminophenyl) sulfone(APS), bis[4-(3-aminophenoxy)-phenyl] sulfone(BAPS), 2,2-bis(4-aminophenyl)-hexafluoropropane(6FPD), 2,2-bis[4-(4-aminophenoxy)-phenyl]hexafluoropropane(6FBAPP), 2,2'-bis(trifluoromethyl)benzidine(TFDB) 및 1,4-phenylenediamine(PDA) 등 6종류의 디아민 단량체를 이용하여 폴리이미드(PI) 박막을 제조하였다. 이들 박막의 잔류응력 거동은 thin film stress analyzer(TFSA)를 이용하여 전구체의 열적 이미드화에 따라 in-situ로 측정하였으며, 모폴로지 변화를 통해 해석하였다. 박막의 분자 배향성 및 질서도에 따라 잔류응력은 23.1에서 12.5MPa의 값을 보였으며, 사슬이 강직할수록 감소하였다. 열 특성은 시차 주사 열량계(DSC), 열 중량 분석기(TGA) 및 열 기계 분석기(TMA)를 이용하여 측정하였고, 광학 특성은 자외선/가시광선 분광광도계(UV-vis)와 색차계를 이용하였다. 제조된 박막의 특성변화는 그 화학구조와 밀접한 관련이 있으며, 잔류응력과 광학 특성은 트레이드-오프(trade-off)됨을 확인할 수 있었다.

Keywords: polyimide; residual stress behavior; optical property; morphology.