Article
  • Preparation of Acrylic Pressure Sensitive Adhesives for Optical Applications and Their Adhesion Performance
  • Baek SS, Jang SJ, Lee JH, Kho DH, Lee SH, Hwang SH
  • 광학용 아크릴 점착제 제조 및 점착특성에 관한 연구
  • 백승석, 장세정, 이종훈, 고동한, 이상훈, 황석호
Abstract
To prepare acrylic pressure sensitive adhesives (PSAs), quaternary copolymer syrups were photopolymerized from 2-ethylhexyl acrylate and 2-hydroxyethyl acrylate as default constituents and isobornyl acrylate and tetrahydrofurfuryl acrylate (THFA) as variable constituents. After polymerization, 1,6-hexanediol diacrylate and photoinitiator were added and then crosslinked by UV-irradiation to prepare the PSAs. The characteristics of the syrup such as viscosity, molecular weight, and solid content were investigated. As increasing THFA contents, the relationship between molecular weight and solid content of the syrup was reciprocal. Also, the relationship between peel strength and surface energy of the PSAs showed the same tendency. All the PSA samples showed high transmittance (more than 92%), low haze (less than 1.0%) and low color-difference (less than 1.0).

본 연구는 2-ethylhexyl acrylate와 2-hydroxyethyl acrylate 기본구조에 isobornyl acrylate와 tetrahydrofurfuryl acrylate(THFA)의 조성비를 변화시키면서 광중합된 4원 공중합체를 합성한 후 가교제로 1,6-hexanediol diacrylate가 혼합된 시럽을 제조하였다. 합성한 시럽에 UV-광원을 조사시켜 점착제를 제조한 후 점착특성과 광학특성을 고찰하였으며 시럽의 기본물성인 고형분, 점도, 및 분자량 분석도 수행하였다. THFA의 함량이 증가할수록 시럽의 분자량은 감소하였으나 고형분은 반대로 증가하였다. 점착제의 박리강도는 THFA의 함량에 따른 반비례관계를 나타내고 점착제의 표면에너지는 비례관계를 나타내었다. 또한 모든 점착제에서 92% 이상의 광투과도와 1.0%이하의 haze값, 그리고 1.0 이하의 색차계값을 보여주었다.

Keywords: pressure sensitive adhesive; tetrahydrofurfuryl acrylate; syrup; peel strength; tack.

  • Polymer(Korea) 폴리머
  • Frequency : Bimonthly(odd)
    ISSN 0379-153X(Print)
    ISSN 2234-8077(Online)
    Abbr. Polym. Korea
  • 2023 Impact Factor : 0.4
  • Indexed in SCIE

This Article

  • 2014; 38(2): 199-204

    Published online Mar 25, 2014

  • 10.7317/pk.
  • Received on Oct 9, 2013
  • Revised on Nov 30, -0001
  • Accepted on Nov 9, 2013

Correspondence to

  • E-mail: