Article
  • Preparation and Release Property of Alginate Beads Immobilizing Poly(N-isopropylacrylamide-co-dimethylamino ethyl methacrylate)
  • Kang MK, Kim JC
  • Poly(N-isopropylacrylamide-co-dimethylamino ethyl methacrylate)가 고정화된 알지네이트 비드 제조 및 방출 특성
  • 강미경, 김진철
Abstract
Alginate beads were prepared using poly(N-isopropylacrylamide-co-dimethylamino ethyl methacrylate)(P(NIPAM-co-DMAEMA)). First, P(NIPAM-co-DMAEMA) was immobilized on the surface of alginate beads by taking advantage of electrostatic interaction between alginate and P(NIPAM-co-DMAEMA). Second, P(NIPAM-co-DMAEMA) was contained in the matrix of alginate beads. P(NIPAM-co-DMAEMA) were prepared by a free radical polymerization at 74 ℃ for 12 h. The weight ratio of NIPAM to DMAEMA monomer was 95/5. The copolymer was identified by 1H-NMR. Releases from the alginate beads were observed at 30, 37, and 45 ℃ using blue dextran or FITCdextran(fluorescein isothiocyanate-dextran) as a model drug. The effect of temperature on the degree of release from the beads was insignificant. FITC-dextran was released more than blue dextran possibly due to its smaller molecular weight.

Poly(N-isopropylacrylamide-co-dimethylamino ethyl methacrylate)(P(NIPAM-co-DMAEMA))가 고 정화된 알지네이트 비드를 제조하였다. 알지네이트와 P(NIPAM-co-DMAEMA)의 정전기적 인력을 이용하여 P(NIPAM-co-DMAEMA)로 코팅된 알지네이트 비드와 P(NIPAM-co-DMAEMA)을 함유한 알지네이트 비드를 제조하였다. P(NIPAM-co-DMAEMA)은 자유 라디칼 반응으로 제조하였고 핵자기 공명분광기를 통해 확인하였다. 비드의 온도 민감성 방출 거동을 관찰하였으며, 모델시약으로 blue dextran과 fluorescein isothiocyanate-dextran을 사용하였다. P(NIPAM-co-DMAEMA)가 고정화된 알지네이트 비드로부터의 방출 정도는 온도 의존성이 낮았고, 방출모델시약의 분자량이 작을수록 더 높았다.

Keywords: alginate beads; N-isopropylacrylamide; dimethylamino ethyl methacrylate; release property

  • Polymer(Korea) 폴리머
  • Frequency : Bimonthly(odd)
    ISSN 0379-153X(Print)
    ISSN 2234-8077(Online)
    Abbr. Polym. Korea
  • 2022 Impact Factor : 0.4
  • Indexed in SCIE

This Article

  • 2010; 34(1): 79-83

    Published online Jan 25, 2010

  • 10.7317/pk.
  • Received on Oct 6, 2009
  • Revised on Nov 30, -0001
  • Accepted on Nov 5, 2009

Correspondence to

  • E-mail: