α,w-Vinyl poly(dimethyl-methylphenyl)siloxane prepolymer (VPMPS) was prepared by the equilibrium polymerization of octamethylcyclotetrasiloxane (D4), 1,3,5-trimethyl-1,3,5-triphenylcyclotrisiloxane (D3Me,Ph), and 1,1,3,3-tetramethyl-1,3-divinylsiloxane (MVS) as end-blocker. And also, α,w-hydrogen poly(dimethyl-methyltrifluoropropyl)siloxane prepolymer (HPDMFS) was prepared from D4, 1,3,5-trimethyl-1,3,5-trifluoropropylcyclotrisiloxane (D3Me,F3P), anc 1,1,3,3-tetramethyldisiloxane. Poly(organosiloxane) rubber composite containing high thermal conductive filler was prepared by compounding VPMPS, HPDMFS, spherical alumina, and catalyst in high speed dissolver. The crosslinking density of poly(organosiloxane) composite was measured by oscillation rheometer. Poly(organosiloxane) composites of TC-POXR-2 and TC-POXR-4 prepared by controlling average diameters of thermal conductive filler, spherical alumina according to Horsfield's packing model were shown to 1.13 W/mK for TC-POXR-2 and 1.19 W/mK for TC-POXR-4.

Octamethylcyclotetrasiloxane(D4)과 1,3,5-trimethyl-1,3,5-triphenylcyclotrisiloxane(D3Me,Ph)을 1,1,3,3,-tetramethyl-1,3-divinylsiloxane(MVS)과 평형중합시켜 dimethylsiloxane과 methylphenylsiloxane block unit를 갖는 α,w-vinyl poly(dimethyl-methylphenyl)siloxane prepolymer(VPMPS)를 제조하였으며 또한 D4와 1,3,5-trimethyl-1,3,5-trifluoropropylcyclotrisiloxane(D3Me,F3P)을 1,1,3,3-tetramethyldisiloxane과 평형중합시켜 dimethylsiloxane과 methyltrifluoropropyl siloxane block unit를 갖는 α,w-hydrogen poly(dimethyl-methyltrifluoropropyl)siloxane prepolymer(HPDMFS)를 제조하였다. VPMPS, HPDMFS, 열전도 필터 및 촉매를 고속교반기에 가하고 130 ℃에서 컴파운딩하여 저경도 poly(organosiloxane) rubber를 제조하였으며 이의 가교밀도는 115 ℃에서 oscillation rheometer를 이용하여 측정하였다. 열전도성 충전제로 구상 알루미나를 Horsfield's packing model에 따라 평균입자경의 분포를 조절하여 제조한 composite TC-POXR-2의 열전도도가 1.13 W/mK, 그리고 TC-POXR-4가 1.19 W/mK였으며 이는 단일입자경을 갖는 충전제를 가하여 제조한 경우보다 높은 열전도성을 나타내었다.

Keywords: equilibrium polymerization; poly(organosiloxane) rubber; crosslinking density; spherical alumina; Horsfield's packing model