Article
  • Morphology and Thermal Properties of PPS/ABS Blends
  • Lee Y, Kim J, Nam J, Park C, Jang S
  • PPS/ABS 블렌드의 형태학적/열적 특성
  • 이영관, 김준명, 남재도, 박찬석, 장승필
Abstract
In this study. the PPS/ABS blend system was investigated in order to collectively identify the relationship among blend morphology, chemical compatibilization and thermal property. ABS resin was chemically modified by the incorporation of maleic anhydride through reactive extrusion for enhanced compatibilization, and PPS, ABS and the modified ABS were blend by a sing twin screw extruder. The effect of chemical modification of ABS on the morphological mechanical and thermal properities of the resulting blend was examined A strong interaction was observed between PPS and MABS by optical microsopy as well as scanning electron microscopy, exhibiting a well-dispersed morphological feature. The PPS/MABS blend showing a single glass transition temperature was observed in dynamic mechanical analysis, demonstrating a pseudo-homogeneous phase morphology induced by chemical compatibilization. PPS/MABS blend also exhibited an enhanced thermal stability and heat distortion temperature compared with modified PPS/ABS blend.

본 연구에서는 poly(phenylene sulfide)(PPS)와 ABS의 물성을 상호보완하기 위하여 블렌드를 제조하였다. 각 성분간의 상용성을 증진시키기 위하여 소량의 무수말레인산을 ABS에 반응시켜 MABS(ABS-g-MAH)를 제조하였으며, PPS/ABS 및 PPS/MABS 블렌드는 이축 혼련 압출기를 이용하여 용융 혼합하였다. 블렌드에서 ABS의 화학적 개질이 블렌드의 모폴로지와 열적 성질에 미치는 영향을 관찰하였다. PPS/MABS 블렌드의 경우, 각 성분간에 강한 인력이 형성되는 것을 광학현미경과 SEM을 이용하여 확인하였으며, DMA 분석에서는 단일 유리전이 온도를 확인하였다. 또한 화학적으로 개질된 MABS를 사용한 PPS/MABS의 블렌드는 PPS/ABS보다 향상된 열적 성질을 나타내었다.

Keywords: PPS/ABS blend; Morphology; Thermal property; Compatibilization

  • Polymer(Korea) 폴리머
  • Frequency : Bimonthly(odd)
    ISSN 0379-153X(Print)
    ISSN 2234-8077(Online)
    Abbr. Polym. Korea
  • 2023 Impact Factor : 0.4
  • Indexed in SCIE

This Article

  • 2000; 24(3): 366-373

    Published online May 25, 2000

  • 10.7317/pk.
  • Received on Nov 30, -0001
  • Revised on Nov 30, -0001
  • Accepted on Nov 30, -0001

Correspondence to

  • E-mail: